IPC 2222 GERMAN : A
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
09-14-2023
Dieses Normenwerk legt die allgemeinen Anforderungen für das Design on Leiterplatten aus organischen Materialien sowie anderen Formen der Bauelementbefestigung oder Verbindungsstrukturen fest. Die organischen Materialien können homogen, verstärkt oder in Kombination mit anorganischen Materialien erarbeitet werden, und die Verbindungen können aus einer Lage, zwei oder mehreren Lagen bestehen.
| DevelopmentNote |
Also available in CD-ROM format. (09/2010)
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| DocumentType |
Standard
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| PublisherName |
Institute of Printed Circuits
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| Status |
Withdrawn
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| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC 4411 : A | SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT |
| IPC 4103 : A | SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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