IEEE 2401-2015
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
IEEE Standard Format for LSI-Package-Board Interoperable Design
01-27-2020
12-18-2015
1. Overview
2. Normative references
3. Definitions, acronyms, and abbreviations
4. Concept of the LPB Format
5. Language basics
6. Common elements in M-Format, C-Format,
and R-Format
7. M-Format
8. C-Format
9. R-Format
10. N-Format
11. G-Format
Annex A (informative) - Bibliography
Annex B (informative) - Examples of utilization
Annex C (informative) - XML Encryption
Annex D (informative) - MD5 checksum
Annex E (informative) - Chip-Package Interface
Protocol
Annex F (informative) - IEEE list of parti cipants
Specifies a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected.
Committee |
Design Automation
|
DevelopmentNote |
Also numbered as IEC 63055. (11/2016)
|
DocumentType |
Standard
|
PublisherName |
Institute of Electrical & Electronics Engineers
|
Status |
Superseded
|
SupersededBy |
IEEE 1364-2005 | IEEE Standard for Verilog Hardware Description Language |
IEC 62433-2:2017 | EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) |
IEC 62433-4:2016 | EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI) |
IEEE 1076-2008 REDLINE | IEEE Standard VHDL Language Reference Manual |
IEC 62433-3:2017 | EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) |
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