IEC TS 62647-21:2013
Current
The latest, up-to-date edition.
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
07-26-2013
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 General discussion of program management/systems
engineering management concerns
5 Requirements definition
6 Use environment(s)
7 Decision criteria
8 Supplier's lead-free control plan
9 Requalification/test plan
10 Rework/repair and maintenance
11 Risk management
12 Cost
13 Presentation to customer
Annex A (informative) - Matrix of tier level
versus associated risk
Annex B (informative) - Links to the European Union
Directives and Executive Order 13148
Annex C (informative) - General program manager
checklist for dealing with Pb-free issues
Annex D (informative) - General manufacturing process
assessment checklist for assessing supplier
compliance to IEC/TS 62647-1
Annex E (informative) - Recommended program language
(subject to contractual agreements)
Bibliography
IEC/TS 62647-21:2013(E) is designed to assist program management and/or systems engineering management in managing the transition to lead-free electronics to assure product reliability and performance. The basic principles delineated in this document can be used for program management and/or systems engineering management of any aerospace and/or high performance program. The annexes in the document describe tools that can be used in conjunction with this document. This document is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with IEC/TS 62647-1.
| Committee |
TC 107
|
| DevelopmentNote |
Supersedes IEC PAS 62647-21. (08/2013) Stability date: 2019. (11/2017)
|
| DocumentType |
Technical Specification
|
| Pages |
34
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| PD IEC/TS 62647-21:2013 | Identical |
| IEC TS 62647-3:2014 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| PD IEC/TS 62647-3:2014 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| ASQ Q9000:2005 | Quality Management Systems - Fundamentals And Vocabulary |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
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