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IEC TS 62239:2008

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Process management for avionics - Preparation of an electronic components management plan

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

07-12-2012

Superseded by

IEC TS 62239-1:2015

Language(s)

English

Published date

10-21-2008

US$193.00
Excluding Tax where applicable

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
  3.1 Terms and definitions
  3.2 Abbreviations
4 Technical requirements
  4.1 Component selection
  4.2 Component application
      4.2.1 Electromagnetic compatibility (EMC)
      4.2.2 De-rating and stress analysis
      4.2.3 Thermal analysis
      4.2.4 Mechanical analysis
      4.2.5 Testing, testability, and maintainability
      4.2.6 Avionics radiation environment
  4.3 Component qualification
      4.3.1 General component qualification requirements
      4.3.2 Component manufacturer quality management
      4.3.3 Component manufacturer process management
            approval
      4.3.4 Demonstration of component qualification
      4.3.5 Qualification of components from a supplier that is
            not qualified
      4.3.6 Distributor quality and process management approval
  4.4 Continuous component quality assurance
      4.4.1 General quality assurance requirements
      4.4.2 On-going component quality assurance
      4.4.3 Plan owner in-house continuous monitoring
      4.4.4 Component design and manufacturing process change
            monitoring
  4.5 Component dependability
      4.5.1 Reliability assessment
      4.5.2 Component availability and associated risk
            assessment
      4.5.3 Component obsolescence
  4.6 Component compatibility with the equipment
      manufacturing process
  4.7 Component data
  4.8 Configuration control
      4.8.1 Alternative sources
      4.8.2 Equipment change documentation
      4.8.3 Customer notifications and approvals
      4.8.4 Focal organisation
5 Plan administration requirements
  5.1 Using components outside the manufacturer's specified
      temperature range
  5.2 Plan organization
  5.3 Plan terms and definitions
  5.4 Plan focal point
  5.5 Plan references
  5.6 Plan applicability
  5.7 Plan implementation
  5.8 Plan acceptance
Bibliography

IEC/TS 62239:2008(E) defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers and regulatory agencies that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the owners of a complete electronic components management plan are avionics equipment manufacturers. This new edition refers to publications that were recently issued.

Committee
TC 107
DevelopmentNote
Supersedes IEC PAS 62239. (05/2003) Supersedes DEFSTAN 59-36/5(1995). (02/2004)
DocumentType
Technical Specification
Pages
25
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
SAC GB/Z 31478 : 2015 Identical
DD IEC/TS 62239:2003 Identical
NEN NPR IEC/TS 62239 : 2008 Identical
PKN IEC/TS 62239 : 2006 Identical

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