IEC TS 61945:2000
Current
The latest, up-to-date edition.
Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
Hardcopy , PDF
English - French
03-10-2000
FOREWORD
Clause
1 Scope and object
2 Normative references
3 Terms
4 Classification of technology analysis
4.1 First level: General visual inspection
(AT1 test)
4.2 Second level: Detailed visual inspection
(AT2 test)
4.3 Third level: Scanning electron microscope
examination under large magnification
(AT3 test)
4.4 Fourth level: Construction analysis (AT4
test)
4.5 Fifth level: Complementary tests (AT5 test)
5 Failure analysis (AT6 test)
5.1 Objective
5.2 Resources
5.3 Description
Gives the methodology for technology and failure analysis in manufacturing integrated circuits. Technology analysis is used to determine the way a component is built by observing it using adequate resolution, which increases progressively with the level of analysis.
| Committee |
TC 47/SC 47A
|
| DevelopmentNote |
Stability Date: 2017. (10/2012)
|
| DocumentType |
Technical Specification
|
| Pages |
23
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN NPR IEC/TS 61945 : 2000 | Identical |
| 13/30286159 DC : 0 | BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| 13/30286163 DC : 0 | BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS |
| 13/30286167 DC : 0 | BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES |
| IEC PAS 62435:2005 | Electronic components - Long-duration storage of electronic components - Guidance for implementation |
| CLC/TS 50466:2006 | Long duration storage of electronic components - Specification for implementation |
| EN 62435-1:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
| UTEC 96 029 : 2011 | ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION |
| I.S. EN 62435-1:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| I.S. CLC TS 50466:2006 | LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
| I.S. EN 62435-5:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
| CEI CLC/TS 50466 : 2006 | LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
| I.S. EN 62435-2:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| BS EN 62435-2:2017 | Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
| DD CLC/TS 50466:2006 | Long duration storage of electronic components. Specification for implementation |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| BS EN 62435-1:2017 | Electronic components. Long-term storage of electronic semiconductor devices General |
| DD IEC/PAS 62435:2005 | Electronic components. Long duration storage of electronic components. Guidance for implementation |
| EN 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
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