IEC TS 61340-5-2:1999
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
08-14-2007
English - French, Spanish, Castilian
02-26-1999
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Signs and markings - General
4.1 Markings
4.1.1 ESDS marking
4.1.2 Packaging marking
4.1.3 Equipment marking
4.3 Signs for ESD protected areas (EPA)
5 ESD protected area (EPA) - General
5.1 Configuration
5.1.1 General
5.1.3 High-voltage EPA
5.2 Requirements for specific ESD protective items
5.2.1 General
5.2.2 Working surfaces and storage racks
5.2.3 Floors
5.2.4 Seating
5.2.5 Garments
5.2.6 Gloves and finger cots
5.2.7 Wrist strap
5.2.8 Footwear
5.2.9 Ionisers
5.2.10 Tools, machinery, dispensers and test equipment
5.2.11 Trolleys and carts
5.3 Construction of an EPA
5.3.1 General
5.3.2 EPA ground facility
5.3.3 EPA ground bonding point (EBP)
5.3.4 EPA ground cords
5.3.5 Electrostatic fields
5.3.6 Certification of conformance
5.4 Field work
5.5 EPA working practices
6 Protective packaging
7 Purchase, receipt, storage and handling
7.1 General
7.2 Purchase
7.3 Receipt and storage
7.4 Unpacking, inspection and storage within an EPA
8 Training
8.1 Relevant structured training ESD
8.2 Personnel training
8.4 Items for consideration in training
8.5 Retraining
8.6 Register of trained personnel
8.7 Training provided by the ESD co-ordinator
8.8 Training officer qualification
9 Quality responsibilities
9.1 Responsibilities
9.2 ESD co-ordinator
9.3 Procurement of ESD protective items
9.4 Checking of electrostatic precautions
9.6 Daily checks
9.6.1 Visual daily check
9.6.2 Wrist straps
9.6.3 Non-permanent footwear
9.7 Monthly checks
9.8 Six-monthly checks
9.8.1 General
9.8.2 Electrostatic fields
9.8.3 Signs and labels
10 Periodic audit instructions
10.1 Table 1 of IEC 61340-5-1 - ESD protective item
requirements
10.2 Table 2 of IEC 61340-5-1 - Packaging
characteristics
10.3 Table 3 of IEC 61340-5-1 - Example of audit
report (summary)
10.4 Table 4 of IEC 61340-5-1 - EPA equipment list
Annex A (normative) Test methods
A.1 - Resistance measurement method for the testing of
floor, working surface or storage rack
A.2 - Resistance measurement method for the testing of
seating
A.3 - Resistance measurement method for the testing of
garments
A.5 - Wrist straps, footwear, gloves, finger cots and
tools
A.6 - Test method and equipment for ionisation
A.7 - Test method for evaluating the performance of
electrostatic discharge shielding material -
Bags
Annex B (informative) Test methods for charge decay
B.1 - Method of measurement of charge decay
Annex C (informative) Design considerations to minimise the
effects of ESD
C.1 - Identification
C.3 - Design of electrostatic discharge sensitive
devices (ESDS)
C.4 - Design of assemblies
C.5 - Packaging design
C.6 - System design
C.7 - Design evaluation procedure
Annex DD (informative) Principles and methods of controlling
static electricity
DD.1 - Methods
DD.2 - Principles
Annex EE (informative) Principles of relationship between
charge, charge density, field and
potential
EE.1 - Insulated conducting body
EE.2 - Insulating body
Annex FF (informative) Bibliography
Figure 101 - Maximum body voltage generated against resistance
Covers the protection from electrostatic discharge (ESD) damage of all electronic devices (components, assemblies and sub-assemblies) with voltage sensitivity of not lower than 100 V throughout their entire life. This is from the commencement of manufacture, through product assembly, product use and possible repair until the end of the product life. Is to be read in conjunction with IEC 61340-5-1.
DevelopmentNote |
To be read in conjunction with IEC 61340-5-1 (11/2001)
|
DocumentType |
Technical Specification
|
Pages |
109
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
EN 61340-5-2:2001/corrigendum:2001 | Identical |
VDE 0300-5-2 : 2002 | Identical |
BS EN 61340-5-2:2001 | Identical |
CEI EN 61340-5-2 : 1ED 2001 | Identical |
PN EN 61340-5-2 : 2002 | Identical |
BS PD IEC 61340-5-2 : 1999 AMD 13197 | Identical |
NEN EN IEC 61340-5-2 : 2001 C11 2001 | Identical |
NF EN 61340-5-2 : 2001 | Identical |
I.S. EN 61340-5-2:1999 | Identical |
TR 61340.5.2-2005 | Identical |
AS 61340.5.2(INT)-2001 | Identical |
UNE-EN 61340-5-2:2002 | Identical |
DIN EN 61340-5-2 : 2002 | Identical |
CEI 101-1 : 2000 | Identical |
03/317589 DC : 0 | IEC 61340-5-1 ED.2 - ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS |
13/30286163 DC : 0 | BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS |
04/30110525 DC : DRAFT MARCH 2004 | IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
BS EN 61760-2:2007 | Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide |
07/30152286 DC : 0 | |
CEI EN 61760-2 : 2008 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
IEC PAS 62435:2005 | Electronic components - Long-duration storage of electronic components - Guidance for implementation |
CLC/TR 62258-3:2007 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
CLC/TS 50466:2006 | Long duration storage of electronic components - Specification for implementation |
06/30155852 DC : DRAFT SEP 2006 | BS EN 60286-3-6 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: TYPE 6 - PACKAGING OF SURFACE MOUNT COMPONENTS ON BLISTER CARRIER TAPES 4 MM IN WIDTH |
PD CLC/TR 62258-3:2007 | Semiconductor die products Recommendations for good practice in handling, packing and storage |
I.S. CLC TS 50466:2006 | LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
BS EN 60747-16-1 : 2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
I.S. EN 60747-16-1:2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
CEI CLC/TS 50466 : 2006 | LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
I.S. CLC/TR 62258-3:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
EIA 4899 : 2001 | STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
OVE/ONORM EN 61760-2 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
07/30169405 DC : 0 | BS EN 60747-16-3 AMD1 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
BS PD IEC 62239 : 2001 | ELECTRONIC COMPONENT MANAGEMENT PLANS |
DD CLC/TS 50466:2006 | Long duration storage of electronic components. Specification for implementation |
IEC PAS 62239:2001 | Electronic component management plans |
CEI EN 60747-16-1 : 2009 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV | Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
DD IEC/PAS 62435:2005 | Electronic components. Long duration storage of electronic components. Guidance for implementation |
BS PD IEC TR 62258-3 : 2005 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
05/30139061 DC : DRAFT SEP 2005 | IEC 60286-3 - PACKING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES |
BS IEC 61340-5.1 : 1998 AMD 13198 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS |
07/30169412 DC : 0 | BS EN 60747-16-4 AMD1 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
I.S. EN 61760-2:2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
EN 60747-16-1:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
IEC TS 60479-1:2005+AMD1:2016 CSV | Effects of current on human beings and livestock - Part 1: Generalaspects |
IEC 61340-4-1:2003+AMD1:2015 CSV | Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors |
IEC 61010-1:2010+AMD1:2016 CSV | Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 1: General requirements |
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