IEC PAS 62686-2:2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-31-2021
English
07-21-2016
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Abbreviations and acronyms
5 Technical requirements
Annex A (normative) - STACK Specification S/0003 IEC
quality assessment systems for high reliability
passive components
Bibliography
IEC PAS 62686-2:2016(E) defines the minimum requirements for general purpose 'off the shelf' COTS passive components for ADHP (Aerospace, Defence and High Performance) applications. This specification shall be used wherever possible for components that typically can be applied to operate in high reliability applications within the manufacturers publicly available datasheet limits. This specification has been derived from STACK Specification S/0003 issue 02. Adoption of the STACK Specification S/0003 issue 02 will enable all existing STACK Certified manufacturers to be audited by IECQ under the STACK-IECQ joint venture.
This publication is to be read in conjunction with IEC 62239-1:2015 for avionics applications.
| Committee |
TC 107
|
| DevelopmentNote |
To be read in conjunction with IEC TS 62239-1. Stability Date: 2017. (07/2016)
|
| DocumentType |
Miscellaneous Product
|
| Pages |
32
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| PD IEC/PAS 62686-2:2016 | Identical |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| MIL-STD-202-211 Base Document:2015 | METHOD 211, TERMINAL STRENGTH |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| SAE AS 9100D : 2016 | QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS FOR AVIATION, SPACE AND DEFENSE ORGANIZATIONS |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| MIL-STD-202-215 Base Document:2015 | METHOD 215, RESISTANCE TO SOLVENTS |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| MIL-STD-202-103 Base Document:2015 | Method 103, Humidity (Steady State) |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| AIAG QS 9000 : 3ED 98 | QUALITY SYSTEM REQUIREMENTS |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
| MIL-STD-202-112 Base Document:2015 | METHOD 112, SEAL |
| MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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