IEC PAS 62250:2001
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-31-2021
English
05-22-2001
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1 SCOPE
1.1 Scope
1.2 Purpose
1.3 Performance Classification and Type
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
2.3 Federal
2.4 Other Publications
3 REQUIREMENTS
3.1 General
3.2 Materials Used in this Specification
3.3 Visual Examination
3.4 Board Dimensional Requirements
3.5 Conductor Definition
3.6 Structural Integrity
3.7 Other Tests
3.8 Solder Resist (Solder Mask) Requirements
3.9 Electrical Requirements
3.10 Cleanliness
3.11 Special Requirements
3.12 Repair
3.13 Rework
4 QUALITY ASSURANCE PROVISIONS
4.1 General
4.2 Acceptance Tests
4.3 Quality Conformance Testing
5 NOTES
5.1 Ordering Data
5.2 Superseded Specifications
APPENDIX A
Covers qualification and performance requirements of rigid printed boards which may be single-sided, double-sided, with or without plated-through holes, multilayer with plated-through holes, multilayer with or without buried/blind vias, and metal core boards.
| DocumentType |
Miscellaneous Product
|
| Pages |
36
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IPC 6012 : C | Identical |
| NEN NPR IEC/PAS 62250 : 2001 | Identical |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 7721 : 1998 | REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC AI 642 : 1988 | USER'S GUIDELINES FOR AUTOMATED INSPECTION OF ARTWORK, INTERLAYERS AND UNPOPULATED PWBS |
| IPC CF 148 : A1998 | RESIN COATED METAL FOR PRINTED BOARDS |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC QL 653 : A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
| NEMA LI 1 : 1998(R2011) | INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
| IPC ET 652 : 1990 | GUIDELINES AND REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
| IPC 6015 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) |
| QQ-S-635 Revision B:1976 | STEEL PLATE, CARBON |
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