IEC PAS 62137-3:2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
11-08-2011
English
11-13-2008
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Procedure of selecting the applicable test method
4.1 Stress to solder joints in the field and test methods
4.2 Selection of test methods based on the shapes and
terminals of electronic components
5 Common subjects in each test method
5.1 Mounting device and materials used
5.2 Soldering condition
5.3 Accelerated endurance test
5.4 Selection of test conditions and analysis of test
results
6 Test method
6.1 Body strength test of SMD before and after the rapid
temperature change test
6.2 Cyclic bending strength test
6.3 Mechanical shear fatigue test
6.4 Cyclic drop test
6.5 Strength test of leaded component
6.6 Fillet lifting phenomenon observation of leaded
component
Annex A (informative) Condition of rapid temperature
change test
Annex B (informative) Soldered joint test by electrical
conduction
Annex C (informative) Torque shear strength test
Annex D (informative) Monotonic bending strength test
Annex E (informative) Cyclic steel ball drop strength test
Annex F (informative) Pull strength test
Annex G (informative) Creep strength test
Annex H (informative) Fillet lifting phenomenon observation
of leaded component solder joint and the life test
by electrical conduction
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
| DocumentType |
Miscellaneous Product
|
| Pages |
41
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NEN NPR IEC/PAS 62137-3 : 2008 | Identical |
| DD IEC PAS 62137-3 : DRAFT 2008 | Identical |
| 11/30252855 DC : 0 | BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| IEC 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| IEC 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 62137-1-1:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test |
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