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IEC 62421:2007

Current

Current

The latest, up-to-date edition.

Electronics assembly technology - Electronic modules

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

08-24-2007

US$103.00
Excluding Tax where applicable

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Business model and interface between supplier and user
  4.1 Business model
      4.1.1 General
      4.1.2 E-type business model
      4.1.3 M-type business model
      4.1.4 F-type business model
  4.2 S-U interface
      4.2.1 S-U interface-1
      4.2.2 S-U interface-2
      4.2.3 S-U interface-3
  4.3 Standardization areas
5 Preferred ratings
  5.1 General
  5.2 Preferred operating temperature range
  5.3 Preferred rated voltage
6 Tests and measuring methods
  6.1 Standard atmospheric conditions
      6.1.1 Standard atmospheric conditions for testing
      6.1.2 Referee conditions
      6.1.3 Reference conditions
  6.2 Electrical performance tests
      6.2.1 General
      6.2.2 Protection of electronic modules and test
            equipment
      6.2.3 Accuracy of measurement
  6.3 Mechanical performance tests
      6.3.1 Robustness of terminations and integral
            mounting devices
      6.3.2 Resistance to soldering heat
      6.3.3 Solderability
      6.3.4 Shock
      6.3.5 Vibration (sinusoidal)
      6.3.6 Resistance to solvents
  6.4 Climatic performance tests
      6.4.1 Dry heat
      6.4.2 Cold
      6.4.3 Damp heat, steady state
      6.4.4 Change of temperature

IEC 62421:2007 provides a generic standard of electronic modules on which their sectional standards are based. It provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided.

Committee
TC 91
DevelopmentNote
Stability Date: 2020. A Bilingual edition has been published on 05/03/2014. (03/2014)
DocumentType
Standard
Pages
16
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NF EN 62421 : 2014 Identical
NEN EN IEC 62421 : 2007 Identical
I.S. EN 62421:2007 Identical
PN EN 62421 : 2008 Identical
UNE-EN 62421:2007 Identical
BS EN 62421:2007 Identical
CEI EN 62421 : 2008 Identical
EN 62421:2007 Identical
DIN EN 62421:2008-06 Identical
PNE-prEN 62421 Identical

PD IEC/TS 62878-2-1:2015 Device embedded substrate Guidelines. General description of technology
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
I.S. EN 61193-2:2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
BS EN 61193-2:2007 Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
PD IEC/TS 62878-2-3:2015 Device embedded substrate Guidelines. Design guide
IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
EN 61193-2 : 2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES

ISO 3:1973 Preferred numbers Series of preferred numbers

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