IEC 62421:2007
Current
The latest, up-to-date edition.
Electronics assembly technology - Electronic modules
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
08-24-2007
FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Business model and interface between supplier and user
4.1 Business model
4.1.1 General
4.1.2 E-type business model
4.1.3 M-type business model
4.1.4 F-type business model
4.2 S-U interface
4.2.1 S-U interface-1
4.2.2 S-U interface-2
4.2.3 S-U interface-3
4.3 Standardization areas
5 Preferred ratings
5.1 General
5.2 Preferred operating temperature range
5.3 Preferred rated voltage
6 Tests and measuring methods
6.1 Standard atmospheric conditions
6.1.1 Standard atmospheric conditions for testing
6.1.2 Referee conditions
6.1.3 Reference conditions
6.2 Electrical performance tests
6.2.1 General
6.2.2 Protection of electronic modules and test
equipment
6.2.3 Accuracy of measurement
6.3 Mechanical performance tests
6.3.1 Robustness of terminations and integral
mounting devices
6.3.2 Resistance to soldering heat
6.3.3 Solderability
6.3.4 Shock
6.3.5 Vibration (sinusoidal)
6.3.6 Resistance to solvents
6.4 Climatic performance tests
6.4.1 Dry heat
6.4.2 Cold
6.4.3 Damp heat, steady state
6.4.4 Change of temperature
IEC 62421:2007 provides a generic standard of electronic modules on which their sectional standards are based. It provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided.
Committee |
TC 91
|
DevelopmentNote |
Stability Date: 2020. A Bilingual edition has been published on 05/03/2014. (03/2014)
|
DocumentType |
Standard
|
Pages |
16
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Standards | Relationship |
NF EN 62421 : 2014 | Identical |
NEN EN IEC 62421 : 2007 | Identical |
I.S. EN 62421:2007 | Identical |
PN EN 62421 : 2008 | Identical |
UNE-EN 62421:2007 | Identical |
BS EN 62421:2007 | Identical |
CEI EN 62421 : 2008 | Identical |
EN 62421:2007 | Identical |
DIN EN 62421:2008-06 | Identical |
PNE-prEN 62421 | Identical |
PD IEC/TS 62878-2-1:2015 | Device embedded substrate Guidelines. General description of technology |
EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
I.S. EN 61193-2:2007 | QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
BS EN 61193-2:2007 | Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages |
BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
PD IEC/TS 62878-2-3:2015 | Device embedded substrate Guidelines. Design guide |
IEC TS 62878-2-3:2015 | Device embedded substrate - Part 2-3: Guidelines - Design guide |
I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
IEC TS 62878-2-1:2015 | Device embedded substrate - Part 2-1: Guidelines - General description of technology |
EN 61193-2 : 2007 | QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
ISO 3:1973 | Preferred numbers Series of preferred numbers |
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