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IEC 62326-4:1996

IEC 62326-4:1996

Current

Current

The latest, up-to-date edition.

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

12-19-1996

Publisher

International Electrotechnical Committee

US$273.00
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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
Hardcopy - Spanish
PDF - Spanish
PDF 3 Users - Spanish
PDF 5 Users - Spanish
PDF 9 Users - Spanish
01
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10

Foreword
Introduction
1 Scope
2 Normative references
3 General
4 Capability approval and maintenance of capability
    approval
5 Test specimens
6 Test sequence
7 Quality assessment
8 Customer detail specification (CDS) data
9 Characteristics of printed boards
10 Capability test programme
11 Quality conformance inspection
12 Test specimens
Figures
1 Resin smear at interface
2 Circumferential defects
3 Conductor pattern defects
4 Minimum annular width (W1) of external land
5 Minimum annular width (W2) of internal land
6 Hole break-out
7 Examples of soldered holes
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography

Applicable to rigid multilayer printed boards irrespective of theirmethod of manufacture. It is the basis on which agreements betweenmanufacturer and user are to be made.Provides additional information necessary to supplement therequirements of the Generic Specification, IEC 62326-1, for theprinted boards intended to be accepted under the IECQ system.Establishes uniform requirements, specifies the characteristics tobe assessed and the test methods to be used for qualityconformance.

DevelopmentNote
Supersedes IEC 60326-6 (03/2001) Also numbered as BS EN 62326-4 and QC 230500. (09/2005) Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
75
PublisherName
International Electrotechnical Committee
Status
Current

BS EN 61249-4-15:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
CEI EN 61249-4-11 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
CEI EN 61249-4-12 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
BS EN 16602-70-10:2015 Space product assurance. Qualification of printed circuit boards
BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
IEC 62326-1:2002 Printed boards - Part 1: Generic specification
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 62326-1:2002 Printed boards - Part 1: Generic specification
EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
NF EN 60352-5 : 2012 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
EN 61249-4-15 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
EN 61249-4-2:2005 Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
EN 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
BS EN 61249-4-18:2013 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
CEI EN 61249-4-16 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
BS EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
00/243930 DC : DRAFT AUG 2000 IEC 60079-18. ED. 2. ELECTRICAL APPARATUS FOR EXPLOSIVE ATMOSPHERES - PART 18: ENCAPSULATION 'M'
I.S. EN 60352-5:2012-2015-10 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012 (EQV))
CEI EN 61249-4-2 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
NF EN 61193-3 : 2013 QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
I.S. EN 16602-70-10:2015 SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS
CEI EN 61249-4-14 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61193-3:2013 QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV))
I.S. EN 61249-4-12:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 61249-4-1:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
IEC 61249-4-14:2009 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 61249-4-5:2005 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
BS EN 60352-5:2012 Solderless connections Press-in connections. General requirements, test methods and practical guidance
CEI EN 60352-5 : 2013 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
I.S. EN 61249-4-15:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
09/30204447 DC : 0 BS EN 60352-5 - SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
BS EN 61193-3:2013 Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
CEI EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
I.S. EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
IEC 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
CEI EN 61249-4-19 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HICH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
CEI EN 61249-4-17 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-16:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
CEI EN 61249-4-15 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
NF EN 62326 4-1 : 1998 PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C
BS EN 61249-4-2:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Multifunctional expoxide woven E-glass prepeg of defined flammability
09/30178203 DC : 0 BS EN 61193-3, ED.1 - QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
I.S. EN 61249-4-19:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-17:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 60352-5:2012/AC:2014 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012)
15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
IEC 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
IEC 61249-4-2:2005 Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
IEC 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 60352-5:2012 Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN 16602-70-10:2015 Space product assurance - Qualification of printed circuit boards
CEI EN 61249-4-1 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
BS EN 61249-4-14:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
I.S. EN 61249-4-11:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 61249-4-14:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
I.S. EN 61249-4-18:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-5:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
CEI EN 61249-4-18 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
CEI EN 61249-4-5 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 62326-1:2002 PRINTED BOARDS - GENERIC SPECIFICATION
I.S. EN 61249-4-2:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
IEC 61249-4-18:2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
EN 61249-4-18 : 2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
EN 61249-4-14 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 62326-1:2002 Printed boards - Part 1: Generic specification
IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

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