IEC 61967-6:2002+AMD1:2008 CSV
Current
The latest, up-to-date edition.
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
06-24-2008
FOREWORD
1 Scope
2 Normative references
3 Definitions
4 General
4.1 Measurement philosophy
4.2 Measurement principle
5 Test conditions
5.1 General
5.2 Frequency range
6 Test equipment
6.1 General
6.2 Magnetic probe
6.3 Probe spacing fixture and placement
7 Test set-up
7.1 General
7.2 Probe calibration
7.3 Modifications to standardized IC test board
7.3.1 Layer arrangement
7.3.2 Layer thickness
7.3.3 Decoupling capacitors
7.3.4 I/O pin loading
8 Test procedure
8.1 General
8.2 Test technique
9 Test report
9.1 General
9.2 Documentation
Annex A (normative) Probe calibration procedure - Microstrip
line method
Annex B (informative) Measurement principle and calibration
factor
Annex C (informative) Spatial resolution of magnetic probe
Annex D (informative) Angle pattern of probe placement
Annex E (informative) Advanced magnetic probe
Bibliography
IEC 61967-6 Ed 1.1:2008 specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact current measurement using a miniature magnetic probe. This method is capable of measuring the RF currents generated by the IC over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the measurement of a single IC or a chip set of ICs on the standardized test board for characterization and comparison purposes. It is also usable to evaluate the electromagnetic characteristics of an IC or group of ICs on an actual application PCB for emission reduction purposes. This method is called the "magnetic probe method". This consolidated version consists of the first edition (2002) and its amendment 1 (2008). Therefore, no need to order amendment in addition to this publication.
DevelopmentNote |
To be used in conjunction with IEC 61967-1. (06/2002) Stability Date: 2023. (09/2017)
|
DocumentType |
Standard
|
Pages |
87
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Standards | Relationship |
DIN EN 61967-6:2008-10 | Identical |
NEN EN IEC 61967-6 : 2002 C1 2010 | Identical |
I.S. EN 61967-6:2003 | Identical |
PN EN 61967-6 : 2003 AMD 1 2008 | Identical |
BS EN 61967-6 : 2002 | Identical |
CEI 47-1025 V1 : 2011 | Identical |
EN 61967-6:2002/A1:2008 | Identical |
NF EN 61967-6 : 2003 AMD 1 2008 | Identical |
PD IEC/TR 61967-4-1:2005 | Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4 |
03/112147 DC : DRAFT JULY 2003 | IEC 61967-3 ED.1 - INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 3: MEASUREMENT OF RADIATED EMISSIONS - SURFACE SCAN METHOD |
BS EN 61967-5:2003 | Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of conducted emissions. Workbench Faraday Cage method |
PD IEC/TS 61967-3:2014 | Integrated circuits. Measurement of electromagnetic emissions Measurement of radiated emissions. Surface scan method |
EN 61967-5:2003 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method |
02/203838 DC : DRAFT MAR 2002 | |
06/30152634 DC : DRAFT JULY 2006 | |
DD IEC TS 61967-3 : DRAFT JAN 2006 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - MEASUREMENT OF RADIATED EMISSIONS - SURFACE SCAN METHOD |
CEI EN 61967-1 : 2002 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 1: GENERAL CONDITIONS AND DEFINITIONS |
ECMA/TR 93 : 1ED 2007 | MEASURING EMISSIONS FROM MODULES |
IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
EN IEC 62969-1:2018 | Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors |
IEC 62969-1:2017 | Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors |
IEC 61967-5:2003 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method |
PD IEC/TS 62132-9:2014 | Integrated circuits. Measurement of electromagnetic immunity Measurement of radiated immunity. Surface scan method |
DD IEC/TS 62239:2003 | Process management for avionics. Preparation of an electronic components management plan |
07/30163156 DC : 0 | BS EN 62433-2 - MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - ICEM-CE, ICEM CONDUCTED EMISSION MODEL |
IEC TS 61967-3:2014 | Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method |
I.S. EN 61967-5:2003 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD |
IEC TS 62132-9:2014 | Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method |
IEC 61967-1:2002 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions |
16/30336986 DC : 0 | BS EN 62969-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 1: GENERAL REQUIREMENTS OF POWER INTERFACE FOR AUTOMOTIVE VEHICLE SENSORS |
IEC TR 61967-4-1:2005 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4 |
IEC TR 62014-3:2002 | Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation |
IEC 61967-1:2002 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions |
IEC 61967-4:2002+AMD1:2006 CSV | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method |
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