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IEC 61967-6:2002+AMD1:2008 CSV

Current

Current

The latest, up-to-date edition.

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

06-24-2008

US$447.00
Excluding Tax where applicable

FOREWORD
1 Scope
2 Normative references
3 Definitions
4 General
  4.1 Measurement philosophy
  4.2 Measurement principle
5 Test conditions
  5.1 General
  5.2 Frequency range
6 Test equipment
  6.1 General
  6.2 Magnetic probe
  6.3 Probe spacing fixture and placement
7 Test set-up
  7.1 General
  7.2 Probe calibration
  7.3 Modifications to standardized IC test board
      7.3.1 Layer arrangement
      7.3.2 Layer thickness
      7.3.3 Decoupling capacitors
      7.3.4 I/O pin loading
8 Test procedure
  8.1 General
  8.2 Test technique
9 Test report
  9.1 General
  9.2 Documentation
Annex A (normative) Probe calibration procedure - Microstrip
        line method
Annex B (informative) Measurement principle and calibration
        factor
Annex C (informative) Spatial resolution of magnetic probe
Annex D (informative) Angle pattern of probe placement
Annex E (informative) Advanced magnetic probe
Bibliography

IEC 61967-6 Ed 1.1:2008 specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact current measurement using a miniature magnetic probe. This method is capable of measuring the RF currents generated by the IC over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the measurement of a single IC or a chip set of ICs on the standardized test board for characterization and comparison purposes. It is also usable to evaluate the electromagnetic characteristics of an IC or group of ICs on an actual application PCB for emission reduction purposes. This method is called the "magnetic probe method". This consolidated version consists of the first edition (2002) and its amendment 1 (2008). Therefore, no need to order amendment in addition to this publication.

DevelopmentNote
To be used in conjunction with IEC 61967-1. (06/2002) Stability Date: 2023. (09/2017)
DocumentType
Standard
Pages
87
PublisherName
International Electrotechnical Committee
Status
Current

PD IEC/TR 61967-4-1:2005 Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4
03/112147 DC : DRAFT JULY 2003 IEC 61967-3 ED.1 - INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 3: MEASUREMENT OF RADIATED EMISSIONS - SURFACE SCAN METHOD
BS EN 61967-5:2003 Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of conducted emissions. Workbench Faraday Cage method
PD IEC/TS 61967-3:2014 Integrated circuits. Measurement of electromagnetic emissions Measurement of radiated emissions. Surface scan method
EN 61967-5:2003 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method
02/203838 DC : DRAFT MAR 2002
06/30152634 DC : DRAFT JULY 2006
DD IEC TS 61967-3 : DRAFT JAN 2006 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - MEASUREMENT OF RADIATED EMISSIONS - SURFACE SCAN METHOD
CEI EN 61967-1 : 2002 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 1: GENERAL CONDITIONS AND DEFINITIONS
ECMA/TR 93 : 1ED 2007 MEASURING EMISSIONS FROM MODULES
IEC TS 62239:2008 Process management for avionics - Preparation of an electronic components management plan
EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
IEC 61967-5:2003 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method
PD IEC/TS 62132-9:2014 Integrated circuits. Measurement of electromagnetic immunity Measurement of radiated immunity. Surface scan method
DD IEC/TS 62239:2003 Process management for avionics. Preparation of an electronic components management plan
07/30163156 DC : 0 BS EN 62433-2 - MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - ICEM-CE, ICEM CONDUCTED EMISSION MODEL
IEC TS 61967-3:2014 Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method
I.S. EN 61967-5:2003 INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD
IEC TS 62132-9:2014 Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
16/30336986 DC : 0 BS EN 62969-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 1: GENERAL REQUIREMENTS OF POWER INTERFACE FOR AUTOMOTIVE VEHICLE SENSORS
IEC TR 61967-4-1:2005 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4
IEC TR 62014-3:2002 Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation

IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
IEC 61967-4:2002+AMD1:2006 CSV Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method

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