IEC 61249-3-5:1999
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Hardcopy , PDF
English, English - French, Spanish, Castilian
02-10-1999
FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
reference numbers
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61249-3-5 : 2002 | Identical |
| NEN EN IEC 61249-3-5 : 1999 | Identical |
| I.S. EN 61249-3-5:1999 | Identical |
| PN EN 61249-3-5 : 2002 | Identical |
| BS EN 61249-3-5:1999 | Identical |
| EN 61249-3-5:1999 | Identical |
| DIN EN 61249-3-5:1999-11 | Identical |
| DS EN 61249-3-5 : 1999 | Identical |
| UNE-EN 61249-3-5:2000 | Identical |
| IEC 60249-2-8:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film |
| IEC 60249-2-15:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability |
| IEC 60249-2-13:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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