IEC 61249-2-12:1999
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
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01-29-1999
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
7 Non-electrical properties of the base material after
complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
numbers
Gives requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.
| Committee |
TC 91
|
| DevelopmentNote |
Also numbered as BS EN 61249-2.12 (08/2004) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61249-2-12 : 2002 | Identical |
| NFC 93 074 : 1996 PR | Identical |
| NEN EN IEC 61249-2-12 : 1999 | Identical |
| I.S. EN 61249-2-12:1999 | Identical |
| PN EN 61249-2-12 : 2002 | Identical |
| SN EN 61249-2-12 : 1999 | Identical |
| EN 61249-2-12:1999 | Identical |
| DIN EN 61249-2-12:1999-11 | Identical |
| UNE-EN 61249-2-12:2001 | Identical |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| EN 62326-1:2002 | Printed boards - Part 1: Generic specification |
| BS EN 62326-1:2002 | Printed boards Generic specification |
| CEI EN 62326-1 : 2002 | PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62326-1:2002 | PRINTED BOARDS - GENERIC SPECIFICATION |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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