IEC 61191-1:2018
Current
The latest, up-to-date edition.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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09-14-2018
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IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-5953-5
|
| Pages |
0
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| DS/EN IEC 61191-1 : 2018 | Identical |
| UNE-EN IEC 61191-1:2018 | Identical |
| JIS C 61191-1:2021 | Identical |
| NEN EN IEC 61191-1:2018 | Identical |
| PN-EN IEC 61191-1 : 2019 | Identical |
| OVE EN IEC 61191-1: 2019 07 01 | Identical |
| BS EN IEC 61191-1:2018 | Identical |
| EN IEC 61191-1:2018 | Identical |
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