• Shopping Cart
    There are no items in your cart

IEC 61189-5-503:2017

Current

Current

The latest, up-to-date edition.

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, English

Published date

05-22-2017

US$174.00
Excluding Tax where applicable

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing condition
5 Specimen
6 Equipment/Apparatus or material
7 Resistance measurement method
8 Test method
9 Procedure
Annex A (informative) - Forms of electrochemical migration
Bibliography

IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

Committee
TC 91
DevelopmentNote
Stability Date: 2022. (05/2017)
DocumentType
Standard
ISBN
978-2-8322-7362-3
Pages
47
PublisherName
International Electrotechnical Committee
Status
Current

EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IEC 60721-1:1990+AMD1:1992+AMD2:1995 CSV Classification of environmental conditions - Part 1: Environmental parameters and their severities
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
ASTM D 257 : 2014 Standard Test Methods for DC Resistance or Conductance of Insulating Materials
IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
IPC TM 650 : 0 TEST METHODS MANUAL
IEC 60068-2-67:1995 Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
IEC 60721-2-1:2013 Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity
IPC 9691 : A USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
IEC 60068-3-5:2001 Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers
IEC 60721-3-0:1984+AMD1:1987 CSV Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-3-4:2001 Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.