IEC 61188-5-4:2007
Current
Current
The latest, up-to-date edition.
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English, English - French
Published date
10-30-2007
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Packaging
3.4 Process considerations
4 Small outlined J packages (SOJ)
4.1 Component description
4.2 Component dimensions
4.3 Solder joint fillet design
4.4 Land pattern dimensions
Bibliography
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61188-5-4 : 2016 | Identical |
| GOST IEC 61188-5-4 : 2013 | Identical |
| NEN EN IEC 61188-5-4 : 2007 | Identical |
| I.S. EN 61188-5-4:2007 | Identical |
| PN EN 61188-5-4 : 2008 | Identical |
| UNE-EN 61188-5-4:2007 | Identical |
| BS EN 61188-5-4:2007 | Identical |
| CEI EN 61188-5-4 : 2008 | Identical |
| EN 61188-5-4 : 2007 | Identical |
| DIN EN 61188-5-4:2008-07 | Identical |
| PNE-prEN 61188-5-4 | Identical |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| 16/30333621 DC : 0 | BS EN 61188-7 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| 17/30352677 DC : 0 | BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN |
| BS ISO 16525-9:2014 | Adhesives. Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| 07/30169578 DC : 0 | BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| ISO 16525-9:2014 | Adhesives — Test methods for isotropic electrically conductive adhesives — Part 9: Determination of high-speed signal-transmission characteristics |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60286-5:2003+AMD1:2009 CSV | Packaging of components for automatic handling - Part 5: Matrixtrays |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
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