IEC 61163-2:1998

Contents
Foreword
Introduction
Clause
1. Scope
2. Normative references
3. Definitions
4. Procedure
    4.1 General
    4.2 Programme definition
    4.3 Establish contact between the two parties
         involved
    4.4 Identify the possible flaws and failure modes
         for each component
    4.5 Select stress types, stress levels and stress
         sequence to be used in order to precipitate failures
    4.6 Determine the duration of the reliability stress
         screening process
    4.7 Mathematically analyze initial test results
    4.8 Perform failure analysis
    4.9 Perform stress sequence on the components
    4.10 Determine approval or rejection criteria
    4.11 Develop closed-loop corrective action process
    4.12 Provide feedback to the component manufacturers
    4.13 Discontinue the reliability stress screening process
Figure 1 - Component reliability screening process (general flow
chart)
Figure 2 - Corrective action process
Annex A (informative) Examples of tools for identifying failure
mechanisms in electronic components
Annex B (informative) Data analysis
Annex C (informative) Examples of applications of reliability
stress screening processes

Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.