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IEC 60749-10:2002

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

04-27-2022

Superseded by

IEC 60749-10:2022

Published date

04-09-2002

US$12.00
Excluding Tax where applicable

FOREWORD
1 Scope
2 Normative references
3 Test apparatus
4 Procedure
5 Summary

Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.The contents of the corrigendum of August 2003 have been included in this copy.

Committee
TC 47
DevelopmentNote
Supersedes IEC PAS 62186 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2019. (11/2017)
DocumentType
Standard
Pages
7
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

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I.S. EN 60749-37:2008 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER
EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
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I.S. EN 60747-15:2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))
I.S. EN 62572-3:2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
IEC 62830-1:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
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05/30135664 DC : DRAFT JUN 2005 IEC 60749-37 ED. 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD FOR HANDHELD ELECTRONIC PRODUCTS
BS EN 60747-15:2012 Semiconductor devices. Discrete devices Isolated power semiconductor devices
CEI EN 60749-37 : 2008 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER
IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
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BS EN 62047-5:2011 Semiconductor devices. Micro-electromechanical devices RF MEMS switches
BS EN 62572-3:2016 Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication
I.S. EN 62047-5:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
IEC 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
IEC 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices
IEC 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
I.S. EN 62149-2:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES
BS EN 60749-37:2008 Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
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I.S. EN 62149-8:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES
IEC 60747-5-6:2016 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
IEC 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
EN 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
EN 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices
OVE/ONORM EN 60749-37 : 2008 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER

IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock

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