IEC 60286-3:2013
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
12-31-2021
Superseded by
Language(s)
English - French
Published date
05-17-2013
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.
FOREWORD
INTRODUCTION
1 General
2 Terms and definitions
3 Structure of the specification
4 Dimensional requirements for taping
5 Polarity and orientation requirements
of components in the tape
6 Carrier tape requirements
7 Cover tape requirements (for type 1a, 1b,
2a, 2b and 3)
8 Component taping and additional tape requirements
9 Reel requirements
10 Tape reeling requirements
Annex A (normative) - Recommended measuring methods
for type 1b
Bibliography
IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition:
a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes);
b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).
| Committee |
TC 40
|
| DevelopmentNote |
Formerly IEC 286-3 (05/2002) Stability Date: 2017. (10/2012) Supersedes IEC 60286-3-1 & IEC 60286-3-2. (05/2013)
|
| DocumentType |
Standard
|
| Pages |
77
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| SN EN 60286-3:2013 (EN 60286-3)+AC:2013 | Identical |
| UNE-EN 60286-3:2000 | Identical |
| JIS C 0806-3:2014 | Identical |
| NEN EN IEC 60286-3 : 2013 C11 2013 | Identical |
| DIN EN IEC 60286-3:2019-08 | Identical |
| BS EN 60286-3:2013 | Identical |
| CEI EN 60286-3 : 2014 | Identical |
| EN 60286-3:2013/AC:2013 | Identical |
| NF EN 60286-3 : 2015 | Identical |
| DIN EN 60286-3:2014-02 | Identical |
| UNE 20526-3:1996 | Identical |
| SN EN 60286-3 : 1998 | Identical |
| CEI 40-10 : 2ED 1998 | Identical |
| DIN IEC 60286-3:1992-11 | Identical |
| PNE-FprEN 60286-3 | Identical |
| UNE-EN 60286-3:2013 | Identical |
| PN EN 60286-3 : 2013 AC 2014 | Identical |
| BS CECC 00802:1991 | Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality |
| CEI CECC 32101-804 : 2002 | SPECIFICA DI DETTAGLIO: CONDENSATORI FISSI CERAMICI MULTISTRATO A MONTAGGIO SUPERFICIALE, CLASSE 1, SOTTOCLASSE 1B, TIPO CG, CATEGORIA CLIMATICA 55/125/56, LIVELLO EZ |
| 04/30110525 DC : DRAFT MARCH 2004 | IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| I.S. EN 61188-5-2:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
| BS EN 61760-2:2007 | Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide |
| 06/30155911 DC : DRAFT SEP 2006 | BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| CEI EN 61760-2 : 2008 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| CEI EN 61760-1 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| I.S. EN 140402:2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 62090:2017 | PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
| CEI CECC 32101-805 : 2002 | DETAIL SPECIFICATION: FIXED MULTILAYER CERAMIC SURFACE MOUNTING CAPACITORS, CLASS 2, SUB-CLASSES 2C1 AND 2R1, CLIMATIC CATEGORY 55/125/56, ASSESSMENT LEVEL EZ, WITH FAILURE RATE LEVELS |
| CLC/TR 62258-3:2007 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
| EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| EN 60286-3-1:2009 | Packaging of components for automatic handling – Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes |
| EN 129000:1993/A1:1995 | GENERIC SPECIFICATION - FIXED RF WOUND INDUCTORS |
| EN 129100 : 93 AMD 1 95 | SECTIONAL SPECIFICATION: WIREWOUND SURFACE MOUNTING INDUCTORS |
| EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| EN 140401:2009 | Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
| EN 140402:2015/A1:2016 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| A-A-59532-1 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 63 VOLTS (V) AC/DC, QUICK ACTING |
| A-A-59532-6 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 250 VOLTS (V) AC/DC, TIME DELAY |
| A-A-59533 Revision A:2006 | FUSEHOLDER, BLOCK, 5 AMPERE (A), 125 VOLTS (V) AC/DC, SURFACE MOUNT (SM), GENERAL REQUIREMENTS FOR |
| A-A-59532-4 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 125 VOLTS (V) AC/DC, QUICK ACTING, HIGH BREAKING CAPACITY, WITH A FUSEHOLDER, BLOCK |
| A-A-59532-3 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 125 VOLTS (V) AC/DC, QUICK ACTING, HIGH BREAKING CAPACITY |
| A-A-59532-5 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 250 VOLTS (V) AC/DC, QUICK ACTING |
| A-A-59532-2 Revision A:2006 | FUSE, INCLOSED LINK, SURFACE MOUNT (SM), 63 VOLTS (V) AC/DC, QUICK ACTING WITH FUSEHOLDER, BLOCK |
| BS ISO 21067-1:2016 | Packaging. Vocabulary General terms |
| 06/30155852 DC : DRAFT SEP 2006 | BS EN 60286-3-6 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: TYPE 6 - PACKAGING OF SURFACE MOUNT COMPONENTS ON BLISTER CARRIER TAPES 4 MM IN WIDTH |
| PD CLC/TR 62258-3:2007 | Semiconductor die products Recommendations for good practice in handling, packing and storage |
| BS EN 60286-3-1:2009 | Packaging of components for automatic handling Packaging of surface mount components on continuous tapes. Type V. Pressed carrier tapes |
| 06/30156418 DC : DRAFT SEP 2006 | BS EN 60286-3-5 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: TYPE 5: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS PRESSED CARRIER TAPES |
| BS EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| 09/30186180 DC : 0 | BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| 09/30207307 DC : 0 | BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS |
| EN 60286-1:2017 | Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes |
| I.S. EN 60115-8:2012 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
| I.S. EN 60115-8-1:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| I.S. EN 60393-6:2016 | POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
| I.S. EN 61188-5-4:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| IEC 60286-1:2017 | Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes |
| I.S. EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 60115-8-1:2014 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| I.S. EN 60286-1:2017 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 1: TAPE PACKAGING OF COMPONENTS WITH AXIAL LEADS ON CONTINUOUS TAPES |
| EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
| OVE/ONORM EN 61760-1 : 2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| I.S. CLC/TR 62258-3:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| CEI EN 60115-8-1 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| 97/231700 DC : DRAFT DEC 1997 | IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 60286-1:2017 | Packaging of components for automatic handling Tape packaging of components with axial leads on continuous tapes |
| BS EN 140401-801 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| BS EN 140401-803 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| BS EN 61188-5-4:2007 | Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides |
| BS EN 61760-1:2006 | Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
| BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
| 06/30155905 DC : DRAFT SEP 2006 | BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| 14/30317306 DC : 0 | BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| BS EN 60286-3-2:2009 | Packaging of components for automatic handling Packaging of surface mount components on continuous tapes. Type VI. Blister carrier tapes of 4 mm width |
| BS EN 140402 : 2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 140401-804:2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| BS EN 140401-804 : 2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| BS EN 140401:2009 | Blank Detail Specification. Fixed low power film surface mount (SMD) resistors |
| NF EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| ISO 21067-1:2016 | Packaging Vocabulary Part 1: General terms |
| EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| NF EN 140402-801 : 2005 | DETAIL SPECIFICATION: FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5, 1, 2 |
| IEC 60115-8:2009 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| IEC 60393-6:2015 | Potentiometers for use in electronic equipment - Part 6: Sectional specification - Surface mount preset potentiometers |
| EN 140401-804:2011/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| OVE/ONORM EN 61760-2 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| 10/30237986 DC : 0 | BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| 08/30186808 DC : DRAFT JULY 2008 | BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
| BS EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| CEI EN 60384-3-1 : 2007 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
| 09/30209389 DC : 0 | BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
| BS EN 60384-3-1:2006 | Fixed capacitors for use in electronic equipment Blank detail specification: surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte. Assessment level EZ |
| I.S. EN 60286-3-2:2009 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-2: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 6 - BLISTER CARRIER TAPES OF 4 MM WIDTH |
| I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| EN 140401-802:2007/A3:2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| I.S. EN 140401-802:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| I.S. EN 140401-803:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| IEC 60286-3-2:2009 | Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
| IEC 60286-3-1:2009 | Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes |
| BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| BS PD IEC TR 62258-3 : 2005 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| BS EN 60393-6:2016 | Potentiometers for use in electronic equipment Sectional specification. Surface mount preset potentiometers |
| CEI EN 140401 : 2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| BS EN 60115-8:2012 | Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors |
| 16/30350953 DC : 0 | BS EN 60286-1 ED 3.0 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 1: TAPE PACKAGING OF COMPONENTS WITH AXIAL LEADS ON CONTINUOUS TAPES |
| CEI EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| BS EN 140401-802 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| 16/30333617 DC : 0 | BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
| 05/30129971 DC : DRAFT FEB 2005 | EN 140402-801 - DETAIL SPECIFICATION - FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| DIN EN 129101:1994-03 | Blank detail specification: wirewound surface mounting inductors of assessed quality; assessment level E; German version EN 129101:1993 |
| I.S. EN 60384-3-1:2007 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
| I.S. EN 60286-3-1:2009 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-1: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 5 - PRESSED CARRIER TAPES |
| CEI CLC/TR 62258-3 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 140401-801:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| I.S. EN 140401:2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 61760-2:2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| EN 140401-803 : 2007 AMD 3 2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| EN 140401-801:2007/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| IEC 60384-3-1:2006 | Fixed capacitors for use in electronic equipment - Part 3-1: Blank detail specification: Surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte - Assessment level EZ |
| BS EN 61188-5-2:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 60384-3-1:2006/corrigendum:2009 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
| EN 60393-6:2016 | Potentiometers for use in electronic equipment - Part 6: Sectional specification - Surface mount preset potentiometers |
| EN 60115-8:2012 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| EN 61188-5-4 : 2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| EN 60286-3-2 : 2009 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-2: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 6 - BLISTER CARRIER TAPES OF 4 MM WIDTH |
| IEC 60286-3-2:2009 | Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width |
| IEC 60286-3-1:2009 | Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| ISO 11469:2016 | Plastics — Generic identification and marking of plastics products |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
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