IEC 60191-2:2012 DB
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 2: Dimensions
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Published date
09-21-2012
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FOREWORD
PREFACE
Chapter 00 - PHILOSOPHY OF MECHANICAL STANDARDIZATION
Chapter 0 - RECOMMENDED VALUES FOR CERTAIN DIMENSIONS
OF DRAWINGS OF SEMICONDUCTOR DEVICES
Chapter I - DEVICE OUTLINE DRAWINGS - TYPES OF SEMICONDUCTOR
DEVICES GENERALLY MOUNTED IN THE PACKAGES OF
CHAPTER I
Chapter II - BASE DRAWINGS
Chapter III - CASE OUTLINE DRAWINGS
Chapter IV - GAUGE DRAWINGS
Chapter V - TABLES SHOWING ASSOCIATIONS BETWEEN CASE OUTLINES
AND BASES
OBSOLETE DRAWINGS -
ADDITIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2
DELETIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2
Contains more than 220 standard sheets covering device outline drawings and the types of semiconductor devices generally mounted in the packages. Published in the IEC since 1966, the drawings given in this publication represent the unification of national standards. The database version of this publication avails the standard sheets in PDF format and it also provides search facilities for easy retrieval of the drawings.
Following years subscription CHF 150.-
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Also available in CD-ROM format. Also available in Database format. (09/2012) Stability Date: 2020. (09/2017) New Child IEC 60191-2 : 1.0 : AMD 21 2020 is now added
|
| DocumentType |
Standard
|
| Pages |
766
|
| ProductNote |
New Child IEC 60191-2 : 1.0 : AMD 21 2020 is now added
|
| PublisherName |
International Electrotechnical Committee
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| Status |
Current
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| Supersedes |
|
| Standards | Relationship |
| AS 3708.2-1989 | Identical |
| DIN 41872:1973-07 | Similar to |
| DIN 41885:1976-02 | Identical |
| DIN 41882-3:1980-05 | Similar to |
| DIN 41887:1974-08 | Similar to |
| DIN 41886:1974-08 | Similar to |
| NEN 10191-2 : 1997 | Identical |
| DIN 41878:1983-06 | Identical |
| DIN 41888:1976-10 | Identical |
| BS IEC 60191-2 : 1966 | Identical |
| NEN IEC 60191-2 : 1997 AMD 19 2012 | Identical |
| DIN 41875:1973-08 | Similar to |
| DIN 41889:1974-08 | Similar to |
| BS 3934:Addendum No. 6:1989 | Similar to |
| BS 3934:1965 | Similar to |
| BS 3934-2(1992) : 1992 AMD 13374 | Identical |
| BS CECC 00802:1991 | Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality |
| BS CECC 20005(1986) : 1986 AMD 8004 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PHOTODIODES, PHOTODIODE ARRAYS (NOT INTENDED FOR FIBRE OPTIC APPLICATIONS) |
| BS E9376(1976) : 1976 AMD 7597 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. VARIABLE CAPACITANCE DIODE(S) |
| BS IEC 60191-1:2007 | Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices |
| EN IEC 60191-1:2018 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| BS CECC 50010(1983) : 1983 AMD 7591 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - AMBIENT RATED THYRISTORS |
| 13/30284025 DC : 0 | BS EN 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA) |
| BS EN 60191-3:2000 | Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits |
| BS CECC 50013(1984) : 1984 AMD 7594 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS BLANK DETAIL SPEC - CURRENT REGULATOR & CURRENT REFERENCE DIODES |
| BS QC 720102:1997 | Blank detail specification for laser diode modules with pigtail for fibre optic systems and subsystems |
| BS IEC 62679-1-1:2014 | Electronic paper displays Terminology |
| BS EN 60747-16-10:2004 | Semiconductor devices Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
| 03/117620 DC : DRAFT NOV 2003 | IEC 60747-1 ED.2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL |
| BS QC 750111:1991 | Specification for harmonized system of quality assessment for electronic components. Semiconductor discrete devices. Blank detail specification. Bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A |
| OVE/ONORM EN 60191-1 : 2007 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
| CEI EN 60191-6-13 : 2009 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINEPITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA) |
| I.S. EN 60191-6:2009 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
| BS IEC 60747-1 : 2006 | SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| I.S. EN 60286-4:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV)) |
| EN 60191-6-13:2016 | Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) |
| EN 60603-12:1998 | Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
| EN 61964:1999 | Integrated circuits - Memory devices pin configurations |
| EN 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| EN 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| DIN IEC 60286-3:1992-11 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING; PACKAGING OF LEADLESS COMPONENTS ON CONTINUOUS TAPES |
| BS EN 150012:1993 | Specification for harmonized system of quality assessment for electronic components. Blank detail specification: single gate field-effect transistors |
| BS QC 760201:1992 | Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approval |
| BS EN 60191-6-13:2016 | Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) |
| BS CECC 50012(1978) : 1978 AMD 7593 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - SINGLE GATE FIELD EFFECT TRANSISTORS |
| BS EN 61964:1999 | Integrated circuits. Memory devices pin configurations |
| BS CECC 20003(1986) : 1986 AMD 8002 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PHOTOTRANSISTORS,PHOTODARLINGTON TRANSISTORS,PHOTOTRANSISTOR ARRAYS |
| BS QC 760101:1992 | Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: qualification approval procedure |
| CEI EN 60747-16-10 : 2005 | SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| I.S. EN 60747-16-10:2004 | SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| I.S. EN 60191-1:2007 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
| CEI EN 61747-1 : 2004 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
| IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| BS CECC50008(1992) : 1992 AMD 7698 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BLANK DETAIL SPECIFICATION: AMBIENT RATED RECTIFIER DIODES |
| BS CECC50009(1992) : 1992 AMD 7699 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: CASE RATED RECTIFIER DIODES |
| BS 6062-3:1993 | Packaging of electronic components for automatic handling Specification for packaging of leadless components on continuous tapes |
| CEI EN 60191-1 : 2008 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| BS EN 60191-6-2:2002 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| BS CECC20002(1988) : 1988 AMD 8001 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: INFRARED EMITTING DIODES, INFRARED EMITTING DIODE ARRAYS |
| BS CECC50001(1981) : 1981 AMD 7590 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: GENERAL PURPOSE SEMICONDUCTOR DIODES |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| BS E9374(1976) : 1976 AMD 7596 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: BIPOLAR TRANSISTORS FOR SWITCHING APPLICATIONS |
| 09/30214337 DC : 0 | BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES |
| BS IEC 60748-23-1:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
| BS QC 763000(1990) : AMD 6754 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
| BS IEC 60748-11:2000 | Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| 05/30132036 DC : DRAFT APR 2005 | IEC 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TEST AND BURN-IN SOCKET FOR BGA, LGA, FBGA AND FLGA |
| BS EN 60191-6:2009 | Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| BS EN 60603-12:1998 | Connectors for frequencies below 3 MHz for use with printed boards Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
| BS 3934-1:1992 | Mechanical standardization of semiconductor devices Recommendations for the preparation of drawings of semiconductor devices |
| BS IEC 61747-1 : 1998 AMD 10788 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION |
| BS CECC20006(1988) : 1988 AMD 8005 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PIN PHOTODIODES FOR FIBRE OPTIC APPLICATIONS |
| BS 3934-3:1992 | Mechanical standardization of semiconductor devices Recommendations for the preparation of outline drawings of integrated circuits |
| BS QC790100(1991) : 1991 AMD 10586 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS |
| I.S. EN 61188-5-6:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES |
| I.S. EN 60191-6-13:2016 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA) |
| I.S. EN 60286-3:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV)) |
| IEC 60191-1:2018 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| I.S. EN 60191-6-16:2007 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
| IEC 60748-11:1990 | Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| IEC 62679-1-1:2014 | Electronic paper displays - Part 1-1: Terminology |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
| IEC 60191-6-16:2007 | Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| BS EN 150015:1993 | Harmonized system of quality assessment for electronic components. Blank detail specification: unidirectional transient overvoltage suppressor diodes |
| 12/30244653 DC : 0 | BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION |
| 01/205674 DC : DRAFT JUL 2001 | IEC 60747-16-10 ED.1 - TECHNOLOGY APPROVAL SCHEDULE FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
| BS CECC 50011(1983) : 1983 AMD 7592 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - CASE RATED THYRISTORS |
| IEC 61045-1:1991 | Fixed film resistor networks for use in electronic equipment - Part 1: Generic specification |
| DIN 41870-2:1983-07 | CASES FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS; SURVEY, TERMINAL COVERING |
| BS EN 60191-6-16:2007 | Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| BS EN 60286-3:2013 | Packaging of components for automatic handling Packaging of surface mount components on continuous tapes |
| BS 6062-3:1988 | Packaging of electronic components for automatic handling. Specification for packaging of leadless components on continuous tapes |
| 05/30129010 DC : DRAFT FEB 2005 | IEC 60191-1 ED.2 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
| BS EN 60286-4:2013 | Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms |
| BS EN 61747-1:2000 | Liquid crystal and solid-state display devices Generic specification |
| CEI EN 60286-4 : 2014 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS |
| I.S. EN IEC 60191-1:2018 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
| I.S. EN 61964:2000 | INTEGRATED CIRCUITS - MEMORY DEVICES PIN CONFIGURATIONS |
| CEI EN 60191-6 : 2011 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| BS EN 61188-5-6:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides |
| IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
| IEC 60603-12:1992 | Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 61964:1999 | Integrated circuits - Memory devices pin configurations |
| IEC 60747-16-10:2004 | Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
| IEC 60191-6-13:2016 | Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) |
| EN 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
| 05/30139061 DC : DRAFT SEP 2005 | IEC 60286-3 - PACKING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES |
| 13/30284029 DC : 0 | BS EN 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
| CEI EN 60191-6-16 : 2008 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
| BS 3934-6:1992 | Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages |
| BS E9377(1976) : 1976 AMD 7598 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: CASE RATED BIPOLAR TRANSISTORS FOR HIGH FREQUENCY AMPLIFICATION |
| 04/30122195 DC : DRAFT SEP 2004 | IEC 60747-1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL |
| 05/30132033 DC : DRAFT APR 2005 | IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA) |
| IEC 60747-4-1:2000 | Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification |
| 07/30167960 DC : 0 | BS EN 60191-6 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
| IEC 60748-23-1:2002 | Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
| EN 60747-16-10:2004 | Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| EN 60191-6-16:2007 | Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| EN 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| EN 61747-1:1999/A1:2003 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
| EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
| EN 150012 : 1991 | Blank Detail Specification: Single gate field-effect transistors |
| BS CECC20001(1991) : 1991 AMD 8000 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: LIGHT EMITTING DIODES, LIGHT EMITTING DIODE ARRAYS, LIGHT EMITTING DIODE DISPLAYS WITHOUT INTEGRAL LOGIC AND RESISTORS |
| BS CECC20004(1988) : 1988 AMD 8003 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - AMBIENT RATED PHOTOCOUPLERS WITH PHOTOTRANSISTOR OUTPUT |
| ISO 1101:2017 | Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out |
| ISO 370:1975 | Toleranced dimensions Conversion from inches into millimetres and vice versa |
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