IEC 60068-2-67:1995
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
Hardcopy , PDF
English - French, Russian, Spanish, Castilian
12-13-1995
07-13-2019
1 Scope
2 General description
3 Description of test apparatus
4 Severities
5 Pre-conditioning
6 Initial measurements
7 Testing
8 Intermediate measurements
9 Recovery
10 Final measurements
11 Information to be given in the relevant
specification
Annexes
A (informative) Physical significance of the test
B (informative) Test apparatus and handling
IEC 60068-2-67:1995 Provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects such as corrosion and deformation.
| Committee |
TC 104
|
| DevelopmentNote |
Also numbered as BS EN 60068-2.67. (09/2005) Stability Date: 2019. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| JIS C 0097:2001 | Identical |
| JIS C 60068-2-67:2001/AMENDMENT 1:2023 | Identical |
| I.S. EN 60068-2-67:1997 | Identical |
| NEN 10068-2-67 : 1996 | Identical |
| PN EN 60068-2-67 : 2004 | Identical |
| CEI EN 60068-2-67 : 1997 | Identical |
| NF EN 60068 2-67 : 1998 | Identical |
| EN 60068-2-67:1996 | Identical |
| AS 60068.2.67-2003 | Identical |
| DIN EN 60068-2-67:1996-07 | Identical |
| SAC GB/T 2423.50 : 2012 | Identical |
| NF EN 60068-2-67:1998 | Identical |
| UNE-EN 60068-2-67:1997 | Identical |
| JIS C 60068-2-67:2001 | Identical |
| ONORM OVE EN 60068-2-67 : 1998 | Identical |
| BS ISO 16525-7:2014 | Adhesives. Test methods for isotropic electrically conductive adhesives Environmental test methods |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| 15/30331587 DC : 0 | BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| NF EN 60384-1 : 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
| ISO 16525-7:2014 | Adhesives — Test methods for isotropic electrically conductive adhesives — Part 7: Environmental test methods |
| IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
| IEC 60384-1:2016 RLV | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| EN 61010-2-012:2016 | Safety requirements for electrical equipment for measurement, control and laboratory use - Part 2-012: Particular requirements for climatic and environmental testing and other temperature conditioning equipment |
| EN 60068-3-4:2002 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
| EN 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
| 12/30254691 DC : DRAFT MAR 2012 | BS ISO 16525-7 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 7: ENVIRONMENTAL TEST METHODS |
| 14/30295051 DC : 0 | BS ISO 19095-4 - ADHESIVES - EVALUATION OF THE ADHESION INTERFACE PERFORMANCE IN PLASTIC-METAL ASSEMBLIES - PART 4: ENVIRONMENTAL CONDITION FOR DURABILITY |
| 14/30295038 DC : 0 | BS ISO 19095-1 - ADHESIVES - EVALUATION OF THE ADHESION INTERFACE PERFORMANCE IN PLASTIC-METAL ASSEMBLIES - PART 1: GUIDELINES FOR THE APPROACH |
| BS EN 60068-3-4:2002 | Environmental testing Supporting documentation and guidance - Damp heat tests |
| BS EN IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards |
| CEI EN 60068-3-4 : 2002 | ENVIRONMENTAL TESTING - PART 3-4: SUPPORTING DOCUMENTATION AND GUIDANCE DAMP HEAT TESTS |
| VDI/VDE 5570 Blatt 3:2017-06 | Testing of connectorised and non-connectorised polymer optical fibres (POF) - Testing of mechanical characteristics, environmental influences and aging behaviour |
| 13/30279156 DC : 0 | BS EN 6101-2-012 ED.1 - SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT |
| 15/30329267 DC : 0 | BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
| BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
| IEC PAS 60747-17:2011 | Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation |
| I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| BS ISO 19095-1:2015 | Plastics. Evaluation of the adhesion interface performance in plastic-metal assemblies Guidelines for the approach |
| 07/30149142 DC : 0 | BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 14/30280850 DC : 0 | BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 12/30254694 DC : DRAFT MAR 2012 | BS ISO 16525-8 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 8: ELECTROCHEMICAL-MIGRATION TEST METHODS |
| CEI EN 61189-5-503 : 1ED 2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| BS EN 61010-2-012:2016 | Safety requirements for electrical equipment for measurement, control and laboratory use Particular requirements for climatic and environmental testing and other temperature conditioning equipment |
| I.S. EN 61010-2-012:2016 | SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT |
| I.S. EN 61189-5-503:2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| ISO 20456:2017 | Measurement of fluid flow in closed conduits — Guidance for the use of electromagnetic flowmeters for conductive liquids |
| EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| ISO 19095-1:2015 | Plastics — Evaluation of the adhesion interface performance in plastic-metal assemblies — Part 1: Guidelines for the approach |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| PD IEC/TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60068-3-4:2001 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
| DD IEC/PAS 60747-17:2011 | Semiconductor devices. Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| BS ISO 16525-8:2014 | Adhesives. Test methods for isotropic electrically conductive adhesives Electrochemical-migration test methods |
| I.S. EN 60068-3-4:2002 | ENVIRONMENTAL TESTING - PART 3-4: SUPPORTING DOCUMENTATION AND GUIDANCE - DAMP HEAT TESTS |
| ISO 16525-8:2014 | Adhesives — Test methods for isotropic electrically conductive adhesives — Part 8: Electrochemical-migration test methods |
| IEC 60300-3-5:2001 | Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
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