I.S. EN 61189-11:2013
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV))
Hardcopy , PDF
English
01-01-2013
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of measuring methods
5 Test equipment
6 Calibration of the temperature
7 Procedure for the measuring method
Annex A (normative) - Test report on melting temperatures
of solder alloys
Annex B (informative) - Examples of test result (Method A)
Annex C (informative) - Example of test result (Method B)
Annex ZA (normative) - Normative references to international
Publications with their corresponding
European publications
Bibliography
Explains the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 61189-11 : 2013 | Identical |
| EN ISO 11357-1:2016 | Plastics - Differential scanning calorimetry (DSC) - Part 1: General principles (ISO 11357-1:2016) |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| EN ISO 9453:2014 | Soft solder alloys - Chemical compositions and forms (ISO 9453:2014) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| ISO 11357-1:2016 | Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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