I.S. EN 61188-1-1:1999
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-1: GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
Hardcopy , PDF
English
01-01-1999
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FOREWORD
INTRODUCTION
1 Scope
2 Normative reference
3 Basic requirements
3.1 Design
3.2 Rigid board manufacturer
3.3 Assembly
3.4 Use
4 Deviations from flatness - rigid copper-clad
base material
4.1 Causes
4.2 Prevention and correction
4.3 Test methods and requirements
5 Deviations from flatness - unassembled rigid
printed boards
5.1 Causes
5.2 Prevention
5.3 Ratification
5.4 Requirements for flatness
5.5 Measurement methods
6 Deviations from flatness - rigid printed board
assemblies
6.1 Causes
6.2 Prevention
6.3 Correction
7 Problems associated with placement of surface-mounted
components
7.1 Placement of components (assembly)
7.2 Requirements for 'pick-and-place' machines
8 Deviations from flatness in service
9 Prevention summary
10 Corrective action summary
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Specifies those factors which control the flatness of rigid printed boards and their assemblies.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 61188-1-1:1998-03 | Identical |
| EN 61188-1-1:1997 | Identical |
| BS EN 61188-1-1:1997 | Identical |
| IEC 61188-1-1:1997 | Identical |
| SN EN 61188-1-1 : 1997 | Identical |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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