I.S. EN 60068-2-58:2015
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
Hardcopy , PDF
English
01-01-2015
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National foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes and related
test severities
5 Test equipment
6 Test Td[1]: Solderability of terminations
7 Test Td[2]: Resistance to soldering heat
8 Test Td[3]: Dewetting and resistance to dissolution of
metallization
9 Final measurements
10 Information to be given in the relevant specification
Annex A (normative) - Criteria for visual inspection
Annex B (informative) - Guidance
Annex C (normative) - Application of the test methods to through
hole reflow soldering components (THR)
Annex X (informative) - Cross reference for references to the
prior revision of this specification
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Gives procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
104
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60068-2-58 : 2015 | Identical |
| DIN EN 60068-2-58 : 2016 | Identical |
| SN EN 60068-2-58 : 1999 | Identical |
| BS EN 60068-2-58 : 2015 | Identical |
| UNE-EN 60068-2-58:2006 | Identical |
| EN 60068-2-58:2015/A1:2018 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| IEC TR 60068-3-12:2014 | Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile |
| EN 61249-2-35:2009 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering |
| EN 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61249-2-35:2008 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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