I.S. EN 60068-2-20:2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
Hardcopy , PDF
02-01-2022
English
01-01-2008
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FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of wire and tag terminations
4.1 Object and general description of the test
4.1.1 Test methods
4.1.2 Specimen preparation
4.1.3 Initial measurements
4.1.4 Accelerated ageing
4.2 Method 1: Solder bath
4.2.1 Description of the solder bath
4.2.2 Flux
4.2.3 Procedure
4.2.4 Test conditions
4.2.5 Final measurements and requirements
4.3 Method 2: Soldering iron at 350 degrees C
4.3.1 Description of soldering irons
4.3.2 Solder and flux
4.3.3 Procedure
4.3.4 Final measurements and requirements
4.4 Information to be given in the relevant specification
5 Test Tb: Resistance to soldering heat
5.1 Object and general description of the test
5.1.1 Test methods
5.1.2 Initial measurements
5.2 Method 1: Solder bath
5.2.1 Description of the solder bath
5.2.2 Flux
5.2.3 Procedure
5.2.4 Test conditions
5.2.5 De-wetting
5.3 Method 2: Soldering iron
5.3.1 Description of soldering iron
5.3.2 Solder and flux
5.3.3 Procedure
5.4 Recovery
5.5 Final measurements and requirements
5.6 De-wetting (if applicable)
5.7 Information to be given in the relevant specification
Annex A (informative) Example of apparatus for accelerated
steam ageing process
Annex B (normative) Specification for flux constituents
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
| DevelopmentNote |
Supersedes I.S. HD 323.2.20. (12/2008) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| EN 60068-2-20:2008 | Identical |
| IEC 60068-2-20:2008 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 60068-2-66:1994 | Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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