I.S. EN 140401-803:2007
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
Hardcopy , PDF
01-23-2020
English
12-12-2007
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National Foreword
European foreword
1 Characteristics and ratings
2 Quality assessment procedures
Annex A (normative) - Fixed sample size Qualification Approval
and Quality Conformance Inspection test schedule for fixed
low power surface mount (SMD) resistors
Annex B (informative) - Letter symbols and abbreviations
Bibliography
Specifies various parameters of electronic components of assessed quality in accordance with: EN 60115-1:2001 + A1:2001, EN 140400:2003 and EN 140401:2002.
| DocumentType |
Standard
|
| Pages |
54
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NF EN 140401-803 : 2008 AMD 3 2017 | Identical |
| NEN EN 140401-803 : 2007 AMD 3 2017 | Identical |
| NBN EN 140401-803 : 2007 AMD 2 2013 | Identical |
| BS EN 140401-803 : 2007 | Identical |
| EN 140401-803 : 2007 AMD 3 2017 | Identical |
| DIN EN 140401-803:2013-12 | Identical |
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
| EN 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| CECC 240001 : 1996 | FIXED LOW POWER FILM RESISTORS (LEADED/UNLEADED) |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN 60027-1:2006/A2:2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 1: GENERAL |
| EN 140401:2009 | Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
| IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
| EN 140400:2003 | Sectional specification: Fixed low power surface mount (SMD) resistors |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
| EN 61193-2 : 2007 | QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC TR 60440:1973 | Method of measurement of non-linearity in resistors |
| EN 61340-3-1:2007 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
| EN 60062:2016/AC:2016-12 | MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016) |
| IEC 61340-3-1:2006 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
| EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
| EN 60068-2-13:1999 | Environmental testing - Part 2: Tests - Test M: Low air pressure |
| EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| IEC 60063:2015 | Preferred number series for resistors and capacitors |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| EN 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
| EN 60695-11-5:2017 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
| IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
| IEC 60195:2016 | Method of measurement of current noise generated in fixed resistors |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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