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EN 61249-4-17:2009

Current

Current

The latest, up-to-date edition.

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Published date

06-30-2009

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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Properties
5 Delivery form
6 Quality assurance
7 Packaging and marking
8 Shelf life
9 Ordering information
Bibliography
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications

IEC 61249-4-17:2009(E) gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-38 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 120 °C minimum.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
ISO 11014-1:1994 Safety data sheet for chemical products Part 1: Content and order of sections
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
EN 61249-2-38:2009 Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61249-2-38:2008 Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61249-2-8:2003 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
EN 62326-4:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IEC 61249-2-8:2003 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
EN ISO 9000:2015 Quality management systems - Fundamentals and vocabulary (ISO 9000:2015)
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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