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EN 60368-1:2000/A1:2004

Current

Current

The latest, up-to-date edition.

PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION

Amendment of

EN 60368-1:2000

Published date

09-20-2004

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Foreword
1 General
  1.1 Scope
  1.2 Normative references
  1.3 Order of precedence
2 Terminology and general requirements
  2.1 General
  2.2 Definitions
  2.3 Preferred values for ratings and characteristics
  2.4 Marking
3 Quality assessment procedures
  3.1 Primary stage of manufacture
  3.2 Structurally similar components
  3.3 Subcontracting
  3.4 Incorporated components
  3.5 Manufacturer's approval
  3.6 Approval procedures
  3.7 Procedures for capability approval
  3.8 Procedures for qualification approval
  3.9 Test procedures
  3.10 Screening requirements
  3.11 Rework and repair work
  3.12 Certified records of released lots
  3.13 Validity of release
  3.14 Release for delivery
  3.15 Unchecked parameters
4 Test and measurement procedures
  4.1 General
  4.2 Test and measurement conditions
  4.3 Visual inspection
  4.4 Dimensions and gauging procedures
  4.5 Electrical test procedures
  4.6 Mechanical and environmental test procedures
  4.7 Endurance test procedure
Bibliography
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Defines test methods and general criteria for piezoelectric filters of assessed quality either by using qualification approval or capability approval procedures.

Committee
SR 49
DevelopmentNote
Supersedes EN 167000. (10/2001)
DocumentType
Test Method
PublisherName
European Committee for Standards - Electrical
Status
Current
Supersedes

BS EN 60368-4:2001 Piezoelectric filters Sectional specification. Capability approval
BS EN 60368-3:2010 Piezoelectric filters of assessed quality Standard outlines and lead connections
CEI EN 60368-4 : 2003 PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 4: SECTIONAL SPECIFICATION - CAPABILITY APPROVAL
EN 61837-2:2011/A1:2014 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES (IEC 61837-2:2011/A1:2014)
EN 61837-3:2015 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
EN 60368-3:2010 Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections
BS EN 62047-7:2011 Semiconductor devices. Micro-electromechanical devices MEMS BAW filter and duplexer for radio frequency control and selection
BS EN 61837-3:2015 Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections Metal enclosures
BS EN 60368-4-1:2001 Piezoelectric filters. Blank detail specification. Capability approval
BS EN 61837-2 : 2011 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES
EN 62047-7 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS BAW FILTER AND DUPLEXER FOR RADIO FREQUENCY CONTROL AND SELECTION

HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60368-4:2000 Piezoelectric filters of assessed quality - Part 4 : Sectional specification - Capability approval
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IECQ 001002-3:2005 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES
EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068-2-13:1983 Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 60068-2-64:2008 ENVIRONMENTAL TESTING - PART 2-64: TESTS - TEST FH: VIBRATION, BROADBAND RANDOM AND GUIDANCE
IECQ 001002-2:1998 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 2: DOCUMENTATION
EN 61000-4-2:2009 Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test
EN 60068-2-7:1993 Environmental testing - Part 2: Tests - Test Ga: Acceleration, steady state
IEC 60068-2-64:2008 Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance
IECQ 001004:2006
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
EN 60068-2-27:2009 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
HD 323.2.3 : 200S2 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC GUIDE 102:1996 Electronic components - Specification structures for quality assessment (Qualification approval and capability approval)
EN 60068-2-17:1994 Environmental testing - Part 2: Tests - Test Q: Sealing
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC 60068-2-10:2005 Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth
EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 61000-4-2:2008 Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test
HD 323.2.10 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST J AND GUIDANCE: MOULD GROWTH
IECQ 001002-1:1998 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 1: ADMINISTRATION
EN 60068-2-29:1993 Environmental testing - Part 2: Tests - Test Eb and guidance: Bump
EN 60068-2-13:1999 Environmental testing - Part 2: Tests - Test M: Low air pressure
EN 60068-2-6:2008 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
IEC 60050-561:2014 International Electrotechnical Vocabulary (IEV) - Part 561: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
IEC 60068-2-29:1987 Environmental testing. Part 2: Tests. Test Eb and guidance: Bump
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 61178-1:1993 Quartz crystal units - A specification in the IEC Quality Assessment System for Electronic Components (IECQ) - Part 1: Generic specification
EN 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
EN 60068-2-32:1993 Basic environmental testing procedures - Part 2: Tests - Test Ed: Free fall
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60068-2-52:2017 Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution)
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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