EN 60249-2-14 : 1994 AMD 5 2000
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY
02-01-2006
01-12-2000
FOREWORD
PREFACE
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material
after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other International Publications quoted
in this standard with the references
of the relevant European publications
Provides requirements for properties of phenolic cellulose paper copper-clad laminated sheet, of defined flammability in thicknesses of 0.5 mm up to 3.2 mm.
| Committee |
SR 91
|
| DevelopmentNote |
Supersedes HD 313.2.14 (08/2001)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| BS EN 60249-2-14:1994 | Identical |
| SN EN 60249-2-14 : 1994 AMD 5 2000 | Identical |
| NBN EN 60249 2-14 : 96 AMD 1 2001 | Identical |
| I.S. EN 60249-2-14:1995 | Identical |
| NEN 10249-2-14 : 1994 AMD 4 1995 | Identical |
| PN EN 60249-2-14 : 2002 | Identical |
| NF EN 60249 2-14 : 96 AMD 5 2001 | Identical |
| NEN EN IEC 60249-2-14 : 1994 AMD 5 2001 | Identical |
| IEC 60249-2-14:1988 | Identical |
| DIN EN 60249-2-14:2001-09 | Identical |
| UNE-EN 60249-2-14/A5:2001 | Identical |
| UNE-EN 60249-2-14:1996 | Identical |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
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