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EN 60068-2-44:1995

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Environmental testing - Part 2: Tests - Guidance on Test T: Soldering

Superseded date

09-01-2016

Superseded by

EN 60068-3-13:2016

Published date

03-17-1995

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FOREWORD
SECTION 1: GENERAL
1 Scope
2 Normative references
SECTION 2: GENERAL PRINCIPLES
3 Introduction
4 Solderability of components and wettability of their
    terminations
5 Place of solderability in environmental testing'
6 Solderability tests
7 Wettability tests
8 Explanations of the test conditions
9 Requirements and the statistical character of results
SECTION 3: GUIDE TO THE USE OF THE WETTING BALANCE FOR
           SOLDERABILITY TESTING
10 General
11 Characteristics of test apparatus
12 Examples of representative force time curves
13 Parameters to be measured from the force time trace
Annex ZA (normative) Other international publications
          quoted in this standard with the references of
          the relevant European publications

Provides background information and recommendations for writers of specifications containing references to IEC 60068-2-20, IEC 60068-2-54 and 60068-2-58

Committee
CLC/SR 91
DevelopmentNote
Supersedes HD 323.2.44 (06/2005)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Superseded
SupersededBy

EN 50461:2006 Solar cells - Datasheet information and product data for crystalline silicon solar cells
05/30134155 DC : DRAFT MAY 2005 EN 50461 - SOLAR CELLS - DATASHEET INFORMATION AND PRODUCT DATA FOR CRYSTALLINE SILICON SOLAR CELLS
BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
BS EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment Generic specification
BS EN 50461:2006 Solar cells. Datasheet information and product data for crystalline silicon solar cells
EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification

IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

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