EN 29455-1:1993
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Soft soldering fluxes - Test methods - Part 1: Determination of non-volatile matter, gravimetric method (ISO 9455-1:1990)
05-31-1994
11-19-1993
Cooperating organizations
National foreword
Foreword
Method
1 Scope
2 Normative reference
3 Principle
4 Apparatus
5 Procedure
6 Expression of results
7 Precision
8 Test report
Annex
ZA (normative) Normative references to international
publications with their relevant European
publications
Table
1 Precision data
National annexes
NA (informative) Committees responsible
NB (informative) Cross-reference
Specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. Applies to liquid and paste fluxes of type 1, as defined in ISO 9454-1.
| Committee |
CEN/TC 121
|
| DocumentType |
Standard
|
| PublisherName |
Comite Europeen de Normalisation
|
| Status |
Withdrawn
|
| Standards | Relationship |
| DS EN 29455-1 : 1997 | Identical |
| ONORM EN 29455-1 : 1994 | Identical |
| DIN EN 29455-1:1994-02 | Identical |
| PN EN 29455-1 : 2001 | Identical |
| NEN ISO 9455-1 : 1994 | Identical |
| SN EN 29455-1 : 1995 | Identical |
| UNE-EN 29455-1:1995 | Identical |
| BS EN 29455-1:1994 | Identical |
| UNI EN 29455-1 : 1996 | Identical |
| ISO 9455-1:1990 | Identical |
| NBN EN 29455-1 : 1994 | Identical |
| I.S. EN 29455-1:1994 | Identical |
| NF EN 2199455-1 : 1994 | Identical |
| CEI EN 61189-5-2 : 2016 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| DIN EN ISO 9455-3:1994-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 3: DETERMINATION OF ACID VALUE, POTENTIOMETRIC AND VISUAL TITRATION METHODS |
| BS EN ISO 9455-6:1997 | Soft soldering fluxes. Test methods Determination and detection of halide (excluding fluoride) content |
| I.S. EN ISO 9454-2:2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| I.S. EN 61189-5:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| BS EN 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
| BS EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
| DIN EN ISO 9455-6:1997-03 | Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995); German version EN ISO 9455-6:1997 |
| I.S. EN 61189-5-2:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| EN 61189-5 : 2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
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