EN 140401:2009
Current
The latest, up-to-date edition.
Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
04-08-2009
Introduction
1 Characteristics and ratings
1.1 Dimensions and ratings
1.2 Derating curve
1.3 Resistance range and tolerance on rated resistance
1.3.1 Version A
1.3.2 Version E
1.4 Variation of resistance with temperature and temperature
rise
1.5 Climatic categories
1.6 Limits for change of resistance at tests
1.7 Non-linearity
1.8 Tests related to soldering
1.8.1 Severities for solderability testing
1.8.2 Severities for testing resistance to soldering
heat
1.9 Marking, packaging and ordering designation
1.9.1 Marking of the component
1.9.2 Packaging
1.9.3 Marking of the packaging
1.9.4 Ordering information
1.10 Additional information (not for inspection purpose)
1.10.1 Storage
1.10.2 Mounting
1.10.3 Soldering process
1.10.4 Use of cleaning solvents
2 Quality assessment procedures
2.1 General
2.1.1 Zero defect approach
2.1.2 100% Test
2.1.3 0 Ohm Resistors
2.1.4 Certificate of Conformity (CoC)
2.1.5 Certified test records
2.1.6 Failure rate level
2.2 Qualification approval
2.2.1 Version A
2.2.2 Version E
2.3 Quality conformance inspection
2.3.1 Qualification approval according to
IEC QC 001002-3:2005, Clause 3
2.3.2 Technology approval according to
IEC QC 001002-3:2005, Clause 6
2.3.3 Non-conforming items
Annex A (normative) - Fixed sample size Qualification Approval
and Quality Conformance Inspection test schedule for
fixed low power film resistors
Annex B (informative) - Letter symbols and abbreviations
Bibliography
A blank detail specification is a supplementary document to the sectional specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with European standards nor shall they be so described. In the preparation of the detail specification the content of EN 140400:2003, 1.2 shall be taken into account. The detail specification should be written by using the preferred values given in EN 140400. The detail specification should contain a table of contents prior the first page of the actual specification. For the use of SI units refer to ISO 1000, for the use of letter symbols to be used in electrical technology, refer to EN 60027-1. Notes in this document shall be considered as guidance and are not part of the detail specification itself.
Committee |
CLC/TC 40XB
|
DevelopmentNote |
Supersedes CECC 40401 (08/2002)
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
I.S. EN 140401:2009 | Identical |
PN EN 140401 : 2009 | Identical |
NEN EN 140401 : 2009 | Identical |
NF EN 140401 : 2009 | Identical |
DIN EN 140401:2009-12 | Identical |
UNE-EN 140401:2009 | Identical |
NBN EN 140401 : 2009 | Identical |
BS EN 140401:2009 | Identical |
SN EN 140401 : 2009 | Identical |
CEI EN 140401 : 2009 | Identical |
PNE-FprEN 140401 | Identical |
06/30155911 DC : DRAFT SEP 2006 | BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
I.S. EN 140401-802:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
BS EN 140401-801 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
BS EN 140401-803 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
06/30155905 DC : DRAFT SEP 2006 | BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
I.S. EN 140401-804:2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
BS EN 140401-804 : 2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
EN 140401-804:2011/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
10/30237986 DC : 0 | BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
BS EN 140401-802 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
EN 140401-802:2007/A3:2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
I.S. EN 140401-803:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
I.S. EN 140401-801:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
EN 140401-803 : 2007 AMD 3 2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
EN 140401-801:2007/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
EN 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
CECC 240001 : 1996 | FIXED LOW POWER FILM RESISTORS (LEADED/UNLEADED) |
EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
IEC 60286-2:2015 | Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes |
EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
EN 60027-1:2006/A2:2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 1: GENERAL |
EN 60286-2:2015 | Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes |
IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
EN 140400:2003 | Sectional specification: Fixed low power surface mount (SMD) resistors |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
EN 61193-2 : 2007 | QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC TR 60440:1973 | Method of measurement of non-linearity in resistors |
EN 61340-3-1:2007 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
IEC 60062:2016 | Marking codes for resistors and capacitors |
EN 60062:2016/AC:2016-12 | MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016) |
IEC 61340-3-1:2006 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
EN 60068-2-13:1999 | Environmental testing - Part 2: Tests - Test M: Low air pressure |
EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
IEC 60063:2015 | Preferred number series for resistors and capacitors |
IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IEC 60286-1:2017 | Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes |
EN 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
EN 60695-11-5:2017 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
IEC 60195:2016 | Method of measurement of current noise generated in fixed resistors |
IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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