EIA STD 4899 : 2017-05
Current
Current
The latest, up-to-date edition.
REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
Published date
05-09-2017
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1. SCOPE
2. REFERENCES
3. TECHNICAL REQUIREMENTS
4. ADMINISTRATIVE REQUIREMENTS
5. PLAN TERMS, DEFINITIONS, ABBREVIATIONS,
INITIALS, AND ACRONYMS
6. NOTES
APPENDIX A - COMPLIANCE MATRIX
APPENDIX B - REPORT FOR COMPONENTS USED OUTSIDE THE
MANUFACTURER'S SPECIFIED PERFORMANCE LIMITS
APPENDIX C - LIFE-LIMITED COMPONENTS REPORT
Pertains to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document.
| Committee |
APMC
|
| DevelopmentNote |
Supersedes EIA 4899. (11/2007)
|
| DocumentType |
Revision
|
| ProductNote |
Supersedes EIA 4899. (Seema 11/2007)
|
| PublisherName |
Government Electronics & Information Technology Association
|
| Status |
Current
|
| Supersedes |
| SAE ARP 6379 : 2016 | PROCESSES FOR APPLICATION-SPECIFIC QUALIFICATION OF ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS AND SUB-ASSEMBLIES FOR USE IN AEROSPACE, DEFENSE, AND HIGH PERFORMANCE SYSTEMS |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| SAE AS 6294/2 : 2018 | REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS |
| GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
| EIA 933 : 2015 | REQUIREMENTS FOR A COTS ASSEMBLY MANAGEMENT PLAN |
| IEC TR 62396-7:2017 | Process management for avionics - Atmospheric radiation effects - Part 7: Management of single event effects (SEE) analysis process in avionics design |
| PD IEC/TR 62396-7:2017 | Process management for avionics. Atmospheric radiation effects Management of single event effects (SEE) analysis process in avionics design |
| SAE ARP 6328 : 2016 | GUIDELINE FOR DEVELOPMENT OF COUNTERFEIT ELECTRONIC PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION SYSTEMS |
| SAE AS 6462 : 2014 | AS5553A, FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION VERIFICATION CRITERIA |
| 17/30365636 DC : 0 | BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| SAE ARP 6379 : 2016 | PROCESSES FOR APPLICATION-SPECIFIC QUALIFICATION OF ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS AND SUB-ASSEMBLIES FOR USE IN AEROSPACE, DEFENSE, AND HIGH PERFORMANCE SYSTEMS |
| SAE AS 5553B : 2016 | COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION |
| EIA 933 : 2015 | REQUIREMENTS FOR A COTS ASSEMBLY MANAGEMENT PLAN |
| SAE ARP 4754 : 2010 | GUIDELINES FOR DEVELOPMENT OF CIVIL AIRCRAFT AND SYSTEMS |
| VITA 51.2 : 2016 | PHYSICS OF FAILURE RELIABILITY PREDICTIONS |
| IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
| MIL-HDBK-454 Revision B:2007 | GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT |
| IEC TR 62240-1:2013 | Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating |
| SAE AS 9100D : 2016 | QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS FOR AVIATION, SPACE AND DEFENSE ORGANIZATIONS |
| MIL-HDBK-338 Revision B:1998 | ELECTRONIC RELIABILITY DESIGN HANDBOOK |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| SAE ARP 6338 : 2015 | PROCESS FOR ASSESSMENT AND MITIGATION OF EARLY WEAROUT OF LIFE-LIMITED MICROCIRCUITS |
| IEC 62396-4:2013 | Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects |
| MIL-HDBK-217 Revision F:1991 | RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC 62396-5:2014 | Process management for avionics - Atmospheric radiation effects - Part 5: Assessment of thermal neutron fluxes and single event effects in avionics systems |
| IEC 62396-3:2013 | Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation |
| SAE ARP 5890 : 2011 | GUIDELINES FOR PREPARING RELIABILITY ASSESSMENT PLANS FOR ELECTRONIC ENGINE CONTROLS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| GEIA STD 0009 : 2008 | RELIABILITY PROGRAM STANDARD FOR SYSTEMS DESIGN, DEVELOPMENT AND MANUFACTURING |
| GEIA STD 0008 : 2011 | DERATING OF ELECTRONIC COMPONENTS |
| IEC 62396-1:2016 | Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment |
| GEIA STD 0003 : 2006 | LONG TERM STORAGE OF ELECTRONIC DEVICES |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
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