DD IEC PAS 62686-1 : DRAFT JULY 2011
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
10-27-2018
11-23-2012
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Abbreviationstions
5 Technical requirements
Annex A (normative) - STACK Specification
S/0001 Issue 14
Specifies the minimum requirements for general purpose 'off the shelf' COTS integrated circuits and discrete semiconductors for high reliability applications.
| Committee |
GEL/107
|
| DocumentType |
Draft
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC PAS 62686-1:2011 | Identical |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| EN 100015-3 : 1993 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: REQUIREMENTS FOR CLEAN ROOM AREAS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IPC J STD 035 : 0 | ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
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