CLC/TS 50466:2006
Current
The latest, up-to-date edition.
Long duration storage of electronic components - Specification for implementation
05-12-2006
1 General
2 Normative references
3 Storage decision criteria
3.1 Advantages of storage
3.1.1 Technical simplicity - Rapidity
3.1.2 Solution durability
3.1.3 Preventive storage
3.2 Hazards - Drawbacks
3.2.1 Generic aging hazard
3.2.2 Poor stock dimensioning
3.2.3 Incorrect control of reliability during storage
3.2.4 Freezing equipment functionalities
3.3 Storage cost (Annex C)
3.4 Decision criteria
4 Purchasing procurement
4.1 List of components
4.2 Quantity of components to be stored
4.2.1 Production stock
4.2.2 Field service stock
4.3 When is it worth keeping in stock?
4.4 Procurement recommendations
5 Technical validation of the components
5.1 Purpose
5.2 Relevant field
5.3 Test selection criteria
5.4 Measurements and tests
5.4.1 Sampling
5.4.2 Visual examination, sealing, solderability
5.4.3 Compliance with the electrical specifications
5.4.3.1 Measurement of electrical parameters
5.4.3.2 Temperature impact
5.4.4 Assessment of the supplied batch reliability
5.4.5 Manufacturing control check (technological analysis)
5.5 Sanction
6 Conditioning and storage
6.1 Type of environment
6.2 Elementary storage unit
6.3 Stock management
6.4 Redundancy
6.5 Identification - Traceability
6.6 Initial packaging
6.7 Solderability
6.8 Stabilization bake
6.9 Storage conditions
6.9.1 Storage area
6.9.2 Temperature
6.9.3 Temperature variations
6.9.4 Relative humidity - Chemical attacks - Contamination
6.9.5 Pressure
6.9.6 Electrostatic discharges
6.9.7 Vibrations - Mechanical impacts
6.9.8 Electromagnetic field - Radiation
6.9.9 Light
6.10 Maintaining storage conditions
7 Periodic check of the components
7.1 Objectives
7.2 Periodicity
7.3 Tests during periodic check
8 De-stocking
8.1 Precautions
8.1.1 Electrostatic discharges
8.1.2 Mechanical impacts
8.2 Inspection
9 Feedback
Annex A - Example related to components
A.1 Example of a component list
A.2 Data description
Annex B - Examples of periodic and/or destocking tests
Annex C - Parameters influencing the final price of the
component storage
Annex D - Parameters influencing the quantity of the
components to be stored
Annex E - Failure mechanisms - Hermetically encapsulated and
non-encapsulated active components
Annex F - Failure mechanisms: GaAs components
Bibliography
This document, which is in line with IEC/PAS 62435 relating to the management of obsolescence of electronic components, is first of all a practical guide to methods of long duration storage (more than 5 years) which summarizes the existing practices in the industry.
Committee |
CLC/SR 107
|
DocumentType |
Technical Specification
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
I.S. CLC TS 50466:2006 | Identical |
DD CLC/TS 50466:2006 | Identical |
NEN NPR CLC/TS 50466 : 2006 | Identical |
CEI CLC/TS 50466 : 2006 | Identical |
PKN CLC/TS 50466 : 2007 | Identical |
DIN CLC/TS 50466:2006-12 | Identical |
HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC PAS 62435:2005 | Electronic components - Long-duration storage of electronic components - Guidance for implementation |
IEC TS 61340-5-2:1999 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
EN 60068-2-17:1994 | Environmental testing - Part 2: Tests - Test Q: Sealing |
IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
EN 190000:1995 | Generic Specification: Monolithic integrated circuits |
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