CEI EN 60352-5 : 2013
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
Hardcopy , PDF
10-16-2021
English
01-01-2013
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FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
5 Tests
Annex A (informative) - Practical
guidance
Bibliography
Pertains to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques.
| Committee |
CT 48
|
| DevelopmentNote |
Classificazione CEI 48-26. (09/2001)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 60352-5:2012 | Identical |
| EN 60352-5:2012/AC:2014 | Identical |
| IEC GUIDE 109:2012 | Environmental aspects - Inclusion in electrotechnical product standards |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| EN 60512-1-100:2012 | Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| IEC 60512-1-100:2012 | Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| EN 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| EN 62326-4:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 60050-581:2008 | International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment |
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