CEI EN 60068-2-82 : 2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
Hardcopy , PDF
01-21-2020
English - Italian
01-01-2008
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FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Test equipment
5. Preparation for test
6. Test condition
7. Test schedule
8. Information to be given in the relevant
specification
9. Minimum requirements for a test report
Annex A (normative) - Measurement of the
whisker length
Annex B (informative) - Examples of whiskers
Annex C (informative) - Guidance on the sample
lots and test schedules
Annex D (informative) - Guidance on acceptance
criteria
Annex E (informative) - Background on whisker
growth
Annex F (informative) - Background on
ambient test
Annex G (informative) - Background on damp
heat test
Annex H (informative) - Background on temperature
cycling test
Bibliography
Annex ZA (normative) - Normative references to
international publications with
their corresponding European
publications
Describes the whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-48. (12/2007)
|
| DocumentType |
Standard
|
| Pages |
66
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 60068-2-82:2007 | Identical |
| EN 60068-2-82:2007 | Identical |
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| CEI 50-8/4 : 1998 | PROVE CLIMATICHE E MECCANICHE FONDAMENTALI - PARTE 2: PROVE SUI TERMINALI - PROVA T: SALDATURA |
| EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
| IEC 60068-3-4:2001 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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