BS QC790100(1991) : 1991 AMD 10586

Committees responsible
National foreword
1. Scope
2. General
2.1 Related documents
2.2 Recommended values of temperatures
2.3 Recommended values of voltages
2.4 Definitions related to manufacturing operations
3. Subcontracting
4. Primary stage of manufacture
4.1 Bipolar devices
4.2 Unipolar devices
5. Quality assessment procedures
5.1 Qualification approval procedures
5.2 Capability approval procedures
6. Structural similarity procedures
6.1 General rules
6.2 Test dependent criteria for structural similarity -
      Table 1
7. Groups and sub-groups
      Table II - Group A: Lot-by-lot
      Table III - Group B: Lot-by-lot
      Table IV - Group C: Periodic tests
      Table V - Group D
8. Screening
      Table VI - Screening
9. Sampling requirements
      Table VII - Sampling requirements for Group A tests
      Table VIII - Sampling requirements for Group B, C
      and D tests in which LTPD shall be used
10. Terminal identification
11. Additional information (under consideration)
12. Test and measurement procedures
12.1 Electrical measuring methods
12.2 Mechanical and climatic test methods
12.3 Electrical endurance tests
12.4 Accelerated test procedures
12.5 Correlated measurements
Appendix
A. Guidance and format for drafting blank detail
      specifications

Describes encapsulated semiconductor integrated circuits, including multi-chip integrated circuits, but excluding hybrid circuits. BS AMD 10586 RENUMBERS THIS STANDARD.