BS PD IEC TR 62258-3 : 2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
Hardcopy , PDF
05-30-2008
English
01-01-2005
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INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Handling - Good practice
4.1 General
4.2 Working environmental controls
4.3 General handling precautions
4.4 Cleanroom good practice
5 Process handling issues
5.1 Wafer sawing
5.2 Die sorting
6 Die and wafer transport and storage media
6.1 Wafer carriers and cassettes
6.2 In-process carriers and transport systems
6.3 Packing for shipment of unsawn wafers
6.4 Packing for shipment of sawn wafers
6.5 Packing for shipment of single wafers
6.6 Packing for shipment of die using trays
6.7 Packing for shipment of die using tape-and-reel
6.8 Secondary packing for shipment
7 Storage good practice
7.1 Die and wafer storage
7.2 Short-term storage environment and conditions
7.3 Storage time limitations
7.4 Sawn wafer on wafer frame or ring
7.5 Die products in the production area
7.6 Die in tape-and-reel
7.7 Dry-packed die products
8 Traceability good practice
8.1 General
8.2 Wafer traceability
8.3 Die products traceability
8.4 Wafer and die back side marking
9 Guidelines for long-term storage (die banking) of bare
die and wafers
9.1 General
9.2 Preparing for storage
9.3 Damage to die products during long-term storage
9.4 Long-term storage environment
9.5 Recommended inert atmosphere purity
9.6 Chemical contamination
9.7 Electrical effects
9.8 Protection from radiation
9.9 Periodic qualification of stored die products
10 Good practice for automated handling during assembly
10.1 Removal of die from shipping media
10.2 Equipment out of service
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography
Facilitates the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers. Suggests good practice for the handling, packing and storage of die products.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 04/30110525 DC. (12/2005) Renumbered and superseded by BS PD CLC/TR 62258-3. (05/2008)
|
| DocumentType |
Standard
|
| Pages |
46
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC TR 62258-3:2010 | Identical |
| IEC TS 61340-5-2:1999 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| ISO 14644-1:2015 | Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
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