BS EN ISO 9455-14:2017
Current
The latest, up-to-date edition.
Soft soldering fluxes. Test methods Assessment of tackiness of flux residues
Hardcopy , PDF
English
09-29-2017
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Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Principle
5 Reagents and materials
6 Apparatus
7 Test pieces
8 Procedure
9 Examination of the test piece
10 Expression of results
11 Test report
Defines a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. Pertains to all fluxes, solder pastes and flux cored solder wires.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 16/30337155 DC & BS EN 29455-14. (10/2017)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This document specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
| Standards | Relationship |
| EN ISO 9455-14:2017 | Identical |
| ISO 9455-14:2017 | Identical |
| ISO 197-1:1983 | Copper and copper alloys — Terms and definitions — Part 1: Materials |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| ISO 9455-1:1990 | Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
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