BS EN 61249-8-7:1997
Current
The latest, up-to-date edition.
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
Hardcopy , PDF
English
03-15-1997
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1 Scope
2 Normative references
3 Requirements
3.1 Storage properties
3.2 Containers and their markings
3.3 Adhesion (pressure sensitive tape method)
3.4 Resistance to solvents, fluxes and soldering
3.5 Degree of cure
3.6 Abrasion resistance (pencil hardness)
3.7 Flammability
3.8 Thermal shock
3.9 Solderability
3.10 Environmental
Annexes
A (informative) Conversion table
B (informative) Bibliography
ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives the requirements for the qualification of marking inks used for legends and other identifications used for printed boards. Provides guidance on the suitability of printed boards which feature marking inks.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 61249-8-7 Supersedes 93/210556 DC (11/2005)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| UNE-EN 61249-8-7:1997 | Identical |
| DIN EN 61249-8-7:1997-02 | Identical |
| SN EN 61249-8-7 : 1996 | Identical |
| I.S. EN 61249-8-7:1999 | Identical |
| EN 61249-8-7:1996 | Identical |
| BS 6221-21:2001 | Printed wiring boards Guide to the rework of unassembled boards |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| BS 2011-2.1Z/AD:1977 | Environmental testing. Tests Tests Z/AD. Composite temperature/humidity cyclic test |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| BS EN 60068-2-2:2007 | Environmental testing Tests. Test B. Dry heat |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| BS 2011-2.1T:1981 | Environmental testing. Tests Test T. Soldering |
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