BS EN 61249-2-13:1999
Current
The latest, up-to-date edition.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
Hardcopy , PDF
English
06-15-1999
Important note : All end users must be registered with an Account prior to user licenses being assigned.| Committee |
EPL/501
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| DevelopmentNote |
Also numbered as IEC 61249-2-13 Supersedes 95/208513 DC (08/2004)
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| DocumentType |
Standard
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| Pages |
20
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| PublisherName |
British Standards Institution
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| Status |
Current
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| Supersedes |
Applies to electrical and/or electronic equipment that have a rated input current up to 16 A per phase. Aims to establish a reference for evaluating the immunity of electric and/or electronic equipment when subjected to positive and negative low amplitude voltage fluctuations. Only conducted phenomena are considered, including immunity tests for equipment connected to public and industrial power supply networks. Has the status of a Basic EMC publication. This consolidated version consists of the first edition (1999) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.
| Standards | Relationship |
| SN EN 61249-2-13 : 1999 | Identical |
| EN 61249-2-13:1999 | Identical |
| UNE-EN 61249-2-13:2001 | Identical |
| NF EN 61249-2-13 : 2002 | Identical |
| DIN EN 61249-2-13:1999-11 | Identical |
| I.S. EN 61249-2-13:1999 | Identical |
| BS 6221-21:2001 | Printed wiring boards Guide to the rework of unassembled boards |
| EN 61249-5-1:1996 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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