BS EN 61189-5:2006
Current
The latest, up-to-date edition.
Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
02-28-2009
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
3.1 Accuracy
3.2 Precision
3.3 Resolution
3.4 Report
3.5 Student's t distribution
3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
5.1 Test 5P01: Test-board design guideline
5.2 Test 5P02: Standard mounting process
for CSP/BGA packages
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
8.1 Test 5C01: Corrosion, flux
9 M: Mechanical test methods
9.1 Test 5M01: Peel test method for test-board land
10 E: Electrical test methods
10.1 Test 5E01: Changes of the surface
insulation resistance caused by fluxes
10.2 Test 5E02: Surface insulation resistance,
assemblies
11 N: Environmental test methods
11.1 Test 5N01: Reflow solderability test for
soldering joint
11.2 Test 5N02: Resistance to reflow solderability
of test board
11.3 Test 5N03: Solderability test for test board land
12 X Miscellaneous test methods
12.1 Test 5X01: Liquid flux activity, wetting
balance method
12.2 Test 5X02: Paste flux viscosity - T-Bar
spindle method
12.3 Test 5X03: Spread test, liquid or extracted
solder flux, solder paste and extracted
cored wires or preforms
12.4 Test 5X04: Solder paste viscosity - T-Bar
spin spindle method (applicable to 300 Pa.s
to 1600 Pa.s)
12.5 Test 5X05: Solder paste viscosity - T-Bar
spindle method (applicable to 300 Pa.s)
12.6 Test 5X06: Solder paste viscosity - Spiral
pump method (applicable to 300 Pa.s
to 1600 Pa.s)
12.7 Test 5X07: Solder paste viscosity - Spiral
pump method (applicable to Pa.s)
12.8 Test 5X08: Solder paste - Slump test
12.9 Test 5X09: Solder paste - Solder ball test
12.10 Test 5X10: Solder paste - Tack test
12.11 Test 5X11: Solder paste - Wetting test
12.12 Test 5X12: Flux residues - Tackiness
after drying
12.13 Test 5X13: Spitting of flux-cored wire
solder
12.14 Test 5X14: Solder pool test
Bibliography
Annex ZA (normative) - Normative references to
international publications with
their corresponding European
publications
Describes test methods representing methodologies and procedures that can be applied to test printed board assemblies.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
| Standards | Relationship |
| IEC 61189-5:2006 | Identical |
| EN 61189-5 : 2006 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| EN 62137:2004/corrigendum:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 9455-1:1990 | Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method |
| EN ISO 9001:2015 | Quality management systems - Requirements (ISO 9001:2015) |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| EN 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| ISO 5725-2:1994 | Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method |
| ISO 9001:2015 | Quality management systems — Requirements |
| IPC 9201 : A | SURFACE INSULATION RESISTANCE HANDBOOK |
| EN 61189-1 : 97 AMD 1 2001 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 29455-1:1993 | Soft soldering fluxes - Test methods - Part 1: Determination of non-volatile matter, gravimetric method (ISO 9455-1:1990) |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IPC TR 467 : 0 | SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES) |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| EN ISO 9455-2:1995 | Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993) |
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