BS EN 61076-4-108:2002
Current
Current
The latest, up-to-date edition.
Connectors for electronic equipment. Printed board connectors with assessed quality Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing density of 15 mm, having a basic grid of 2,5 mm in accordance with IEC 60917-1
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
06-02-2003
Publisher
Committee |
EPL/48
|
DevelopmentNote |
Supersedes 98/230857 DC (06/2003)
|
DocumentType |
Standard
|
Pages |
74
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
This publication also bears the number QC 480301XX0009 which is the specification number in the IEC Quality Assessment System for Electronic Components (IECQ).
Standards | Relationship |
IEC 61076-4-108:2002 | Identical |
DIN EN 61076-4-108:2002-12 | Identical |
NF EN 61076-4-108 : 2004 | Identical |
EN 61076-4-108:2002 | Identical |
I.S. EN 61076-4-108:2002 | Identical |
IEC 61076-1:2006 | Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
EN 61076-4-001:1996 | Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors - Section 001: Blank detail specification |
EN 60917-2-2:1996 | Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units |
EN 60352-2:2006/A1:2013 | SOLDERLESS CONNECTIONS - PART 2: CRIMPED CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
IEC 60352-3:1993 | Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance |
IEC 61076-4-100:2001 | Connectors for electronic equipment - Part 4-100: Printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
EN 60512-1-100:2012 | Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
EN 60352-3:1994 | Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
EN 61076-4:1996 | Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors |
EN 61076-1:2006 | Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
EN 61076-4-100:2001 | Connectors for electronic equipment - Part 4-100: Printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes |
IEC 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
EN 60352-5:2012/AC:2014 | SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012) |
ISO 1302:2002 | Geometrical Product Specifications (GPS) Indication of surface texture in technical product documentation |
IEC 60352-5:2012 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
IEC 61076-4:1995 | Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors |
IEC 60512-1-100:2012 | Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60917-2-2:1994 | Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units |
IEC 60352-2:2006+AMD1:2013 CSV | Solderless connections - Part 2: Crimped connections - Generalrequirements, test methods and practical guidance |
EN 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
IEC 60917-1:1998+AMD1:2000 CSV | Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard |
IEC 61076-4-001:1996 | Connectors with assessed quality, for use in d.c., low-frequencyanalogue and in digital high-speed data applications - Part 4:Printed board connectors - Section 001: Blank detail specification |
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