BS EN 165000-2:1996
Current
The latest, up-to-date edition.
Film and hybrid integrated circuits Internal visual inspection and special tests
Hardcopy , PDF
English
10-15-1996
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Section 1. Internal visual inspection
1 General
1.1 Purpose
1.2 Sequence of inspection
1.3 Inspection apparatus
1.4 Inspection environment
1.5 Magnification
1.6 Definitions
1.7 Interpretation
1.8 Alternative test methods
2 Substrate and processes
2.1 Substrate
2.2 Processes
2.2.1 Conductors
2.2.2 Isolating layer
2.2.3 Resistors
2.2.4 Foreign material
3 Assembly - mechanical attachment and electrical
connection to parts of the substrate
3.1 Added components
3.2 Assembly method
3.2.1 General
3.2.2 Soldering and eutectic attachment
3.2.3 Organic adhesive
4 Assembly - mechanical attachment and electrical
connection of substrate to package
4.1 General
4.2 Soldering and organic adhesive
5 Wire interconnections
5.1 General
5.2 Gold ball and wedge bonds
5.3 Gold ball bonds
5.4 Tailless (crescent) bonds
5.5 Wedge bonds
5.6 Compound bonds
5.7 Beam lead bonds
5.8 Bonding wires
6 Foreign material
7 Selectived organic protection
8 Figures
Section 2. Radiographic inspection
1 General
2 Requirements
2.1 Views
2.2 Reports and records
2.3 Examination and acceptance criteria
Section 3. Particle impact noise detection (PIND) test
1 Object
2 General
3 Equipment
4 Test procedure
5 Failure criteria
6 Lot acceptance
7 The detail specification
| Committee |
EPL/47
|
| DevelopmentNote |
Reviewed and confirmed by BSI, Feb 2005. (02/2005) Supersedes 94/216399 DC. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
32
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| I.S. EN 165000-2:1998 | Identical |
| SN EN 165000-2 : 1996 | Identical |
| DIN EN 165000-2:1996-11 | Identical |
| NEN EN 165000-2 : 1996 | Identical |
| EN 165000-2:1996 | Identical |
| BS EN 165000-4:1996 | Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification |
| BS EN 165000-5:1998 | Film and hybrid integrated circuits Procedure for qualification approval |
| BS EN 165000-3:1996 | Film and hybrid integrated circuits Self-audit checklist and report for film and hybrid integrated circuit manufacturers |
| BS EN 165000-3:1996 | Film and hybrid integrated circuits Self-audit checklist and report for film and hybrid integrated circuit manufacturers |
| BS EN 165000-1:1996 | Film and hybrid integrated circuits Generic specification. Capability approval procedure |
| BS EN 165000-4:1996 | Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification |
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