BS EN 123100:1992
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
Hardcopy , PDF
English
09-29-1989
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Foreword
Preface
1. Introduction
1.1 Scope and object
1.2 Related documents
2. General
3. Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
4. Relevant specification
5. Characteristics of printed boards
Table I
Table II
6. Capability test programme
7. Quality conformance inspection
8. Test patterns
8.1 Application of test patterns and test boards
8.2 Composite test pattern (CTP)
8.3 Multiple arrangements of the CTP
Figure 2: Composite test pattern
Defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS CECC23100(1989). 1992 Version incorporates amendment 7358 to BS CECC23100(1989). Supersedes 86/31648 DC and 94/216046 DC. To be read in conjunction with BS CECC23000(1989). (09/2005)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN EN 123100 : 1995 AMD 1 1995 | Identical |
| DIN EN 123100:1992-11 | Identical |
| CECC 23100 : 1985 | Identical |
| EN 123100 : 1992 AMD 1 1995 | Identical |
| SN EN 123100 : AMD 1 1995 | Identical |
| I.S. EN 123100:1994 | Identical |
| BS CECC 23100-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes |
| CECC 00107(PT3) : 80 AMD 1 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL |
| BS CECC23000(1989) : 1989 AMD 7145 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS |
| CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
| CECC 00107(PT2) : 79 AMD 1 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR ENHANCED ASSESSMENT OF QUALITY |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| CECC 00107(PT1) : 1982 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - QUALITY ASSESSMENT PROCEDURE FOR GENERAL USAGE |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| CECC 00111 : 80 AMD 3 | CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY |
| BS 4584:1970 | Specification for metal clad base materials for printed circuits. Methods of test |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| BS 2011(1967) : LATEST |
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