BS CECC 123500-003:1994
Current
The latest, up-to-date edition.
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Hardcopy , PDF
English
02-15-1994
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Committees responsible
Foreword
Specification
1 General
2 Capability qualifying component (CQC)
3 Capability approval
4 Capability test programme
5 Traceability
Appendices
A Untitled
B Untitled
C Untitled
D Untitled
E Edge connector imperfections
F Adhesion of plating: tape method
G Porosity of platings - method of test
H Solvent resistance of organic coatings
J Solder resistance of organic coatings
Tables
I Capability approval test schedule
IIa Additional metallic conductor finishes
IIb Additional contact finishes
III Permanent organic finishes
IV Bonded stiffeners and rigidizers
Figures
1a Composite test pattern for flexible printed boards
with through connections
1b Detailed dimensions of specimens shown in figure 1a
2 Test pattern for marking inks
3 Test pattern for solder mask or coverlayer
4a Assembly of test pattern for rigidizers or
stiffeners
4b Component parts of test pattern for rigidizers or
stiffeners
Relates to double-sided flexible printed boards.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 93/206143 DC. (01/2006)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| BS EN ISO 3543:2001 | Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method |
| BS EN 123000:1992 | Harmonized system of quality assessment for electronic components. Generic specification: printed boards |
| ISO 3542:1975 | Withdrawal of ISO 3542-1975 |
| BS EN ISO 1463:2004 | Metallic and oxide coatings. Measurement of coating thickness. Microscopical method |
| BS 6221-2:1982 | Printed wiring boards Methods of test |
| BS 4584:1970 | Specification for metal clad base materials for printed circuits. Methods of test |
| BS 2011(1967) : LATEST | |
| BS EN 123500:1992 | Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections |
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