BS 9300:1969

Cooperating organizations
Foreword
Section 1. Principles and mandatory requirements
1.1 General matters
1.1.1 Scope
1.1.2 Related documents
1.1.3 Terminology
1.1.3.1 General terms
1.1.3.2 General characteristics
1.1.3.3 Signal diodes
1.1.3.4 Voltage reference, voltage regulator and
         clipper diodes
1.1.3.5 Tunnel diodes
1.1.3.6 Variable capacitance diodes
1.1.3.7 Microwave diodes
1.1.3.8 Rectifier diodes
1.1.3.9 Thyristors
1.1.3.10 Transistors
1.1.3.11 Field effect transistors
1.1.3.12 Switching diodes
1.1.4 Letter symbols, signs and abbreviations
1.1.5 Graphical symbols
1.1.6 Marking of the part and package
1.1.6.1 Terminal identification
1.1.6.2 Colour band identification for manufacturer's
         type number
1.1.6.3 Factory identification code or manufacturer's
         name or trade-mark
1.1.6.4 Date code
1.1.7 Eligibility for qualification approval
1.1.8 Structurally similar devices
1.1.8.1 Devices from the same production line
1.1.8.2 Devices having a common encapsulation and
         mounting method
1.1.9 Delayed delivery
1.1.10 Supplementary procedure for qualification
         approval
1.1.11 Certified test records
1.1.12 Standard ratings and characteristics
1.1.13 Unchecked parameters
1.1.14 Procedure to be followed in the event of failure
         at Group C or D inspection
1.1.15 Supplementary procedure for reduced inspection
1.1.16 Supplementary procedure for general application
         category devices
1.2 Test procedures
1.2.1 Measurement conditions
1.2.2 Visual inspection
1.2.2.1 External inspection
1.2.2.2 Internal inspection
1.2.3 Dimensioning and gauging procedures
1.2.4 Electrical test procedures
1.2.4.1 General
1.2.4.2 Measurement methods:
         0001 etc. General
         1001 etc. Diodes, signal
         1101 etc. Diodes, voltage regulator and
                    reference, transient suppressor
         1201 etc. Diodes, tunnel
         1301 etc. Diodes, variable capacitance
         1401 etc. Diodes, microwave
         1501 etc. Diodes, rectifier
         2001 etc. Thyristors
         3001 etc. Transistors, bipolar, general
                    measurements
         3101 etc. Transistors, bipolar, low frequency
                    measurements
         3200 etc. Transistors, bipolar, switching time
                    measurements
         3400 etc. Transistors, bipolar, microwave
         4000 etc. Transistors, field effect
1.2.5 Mechanical test procedures
1.2.5.1 Directions of applied forces for mechanical
         tests
1.2.6 Environmental test procedures
1.2.6.1 Text deleted
1.2.6.2 Dry heat
1.2.6.3 Accelerated damp heat
1.2.6.4 Shock
1.2.6.5 Vibration (sinusoidal)
1.2.6.6 Acceleration, steady state
1.2.6.7 Rapid change of temperature, two-chamber method
1.2.6.8 Rapid change of temperature, two-bath method
1.2.6.9 Flammability
1.2.6.10 Solderability
1.2.6.11 Robustness of terminals
1.2.6.12 Resistance to solvents
1.2.6.13 Bondability
1.2.6.14 Hermeticity
1.2.6.15 Text deleted
1.2.6.16 Wire bond strength
1.2.6.17 Die shear strength
1.2.7 Electrical endurance test procedures
1.2.7.1 General
1.2.7.2 Signal diodes
1.2.7.3 Voltage reference voltage regulator, clipper
         and transient suppressor diodes
1.2.7.4 Rectifier diodes
1.2.7.5 Thyristors
1.2.7.6 Transistors
1.2.7.7 Microwave diodes and transistors
1.2.7.8 Gunn oscillators
1.2.7.9 Avalanche oscillators
1.2.7.10 Rectifier bridges
1.2.8 Accelerated test procedures
1.2.8.1 Thermally accelerated tests
1.2.9 Encapsulating materials test procedures
1.2.9.1 Flammability (oxygen index method)
1.2.10 Screening procedures
1.2.10.1 Test sequences
1.2.10.2 Rapid change of temperature, thermal shock in
         air, for screening
1.2.10.3 Post burn-in rejection criteria
1.3 Controlled environment
1.3.1 General
1.3.2 Air cleanliness
1.3.3 Humidity
1.3.4 Temperature
1.3.5 Biological
Section 2. Rules for the preparation of detail
specifications
2.1 Basic information
2.1.1 Originator of the specification
2.1.2 The numbering of detail specifications
2.1.3 Description of device and intended application
2.1.4 Outline drawing, terminations, etc.
2.1.5 Ratings (including limiting conditions of use)
2.1.6 Characteristics
2.1.7 Related documents
2.1.8 Supplementary information
2.1.9 Instructions for ordering devices
2.2 Inspection requirements
2.2.1 Group A inspection
2.2.2 Group B inspection
2.2.3 Group C inspection
2.2.4 Group D inspection
2.2.5 Solid encapsulation (plastics) devices
2.3 Certified test records
Appendices
A. Example of the layout of a detail specification
B. List of rules for the preparation of detail
     specifications
C. Procedure for the adoption of specifications in the
     CV7000 series into the BS 9000 system
D. Index of terms given in 1.1.3

Forms part of the system of standards for electronic components of assessed quality. Terms, definitions, test methods and other material necessary to implement fully the detail specifications for semiconductor devices. Included in section 2 are the general rules for preparation of detail specifications. Appendix C gives the agreed procedure for the adoption of specifications in the CV7000 series into the BS 9000 system. See also PD 6460.