BS 6221-2:1991
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed wiring boards Methods of test
Hardcopy , PDF
04-24-2012
English
06-28-1991
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Committees responsible
National foreword
Method
1. Introduction
2. Scope
3. Object
4. General
5. General examination
6. Electrical tests
7. Mechanical tests
8. Miscellaneous tests
9. Environmental conditioning
Annexes
A. List of tests
B. Outgassing test of plated-through holes
Figures
1. Untitled
2. Untitled
3. Test probes for current-carrying capacity test
4. Untitled
5. Solderability
6. Needle burner test. Side views of test board and
burner
7. Abrasion fixture
8. Fluidized sand bath
9. Example of a soldering tool
10. Plier fixture for thermal shock test, dip soldering
11. Schematic layout of steam/oxygen ageing test
apparatus
12. Examples of typical test coupons
B.1 Untitled
B.2 Untitled
B.3 Untitled
B.4 Plated-through hole normal view under stereo
microscope without oil and view of land after
testing with soldering iron
B.5 Plated-through hole with oil. Convex meniscus. The
wall is not visible
B.6 Plated-through hole with oil. Concave meniscus. The
wall is visible
B.7 Defective plate-through hole. Formation of bubbles
in the oil
Test methods and procedures including environmental conditioning for printed boards.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 60326-2 Supersedes BS 6221-2(1982) (09/2005)
|
| DocumentType |
Standard
|
| Pages |
78
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
| BS EN 123800:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections |
| BS 123800-003:2001 | System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections |
| BS EN 123400:1992 | Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 6221-6:1982 | Printed wiring boards Specification for multilayer printed wiring boards |
| BS EN 123500-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
| BS 123200:2001 | System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes |
| BS EN 123400-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
| BS EN 123600:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections |
| BS 4584-103.3:1992 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| BS EN 123500:1992 | Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections |
| BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
| BS 123100:2001 | System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes |
| BS EN 123100:1992 | Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes |
| BS 6221-11:1991 | Printed wiring boards Specification for flex-rigid multilayer printed boards with through connections |
| BS 123500:2001 | System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections |
| BS 123700:2001 | System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123600:2001 | System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections |
| BS EN 60068-2-44:1995 | Environmental testing. Test methods Tests. Guidance on Test T. Soldering |
| BS 123000:2001 | System of quality assessment. Generic specification. Printed boards |
| BS CECC 23200-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes |
| BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
| BS EN 61249-8-7:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks |
| BS 6221-10:1991 | Printed wiring boards Specification for flex-rigid double-sided printed boards with through connections |
| BS CECC 123400-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
| BS EN 123300:1992 | Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards |
| BS EN 123200:1992 | Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes |
| BS 123300:2001 | System of quality assessment. Sectional specification. Rigid multilayer printed boards |
| BS 123100-003:2001 | System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes |
| BS CECC 23300-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards |
| BS 6221-9:1991 | Printed wiring boards Specification for flexible multilayer boards with through connections |
| BS 123400:2001 | System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 6221-4:1982 | Printed wiring boards Method for specifying single and double sided printed wiring boards with plain holes |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| BS EN 123000:1992 | Harmonized system of quality assessment for electronic components. Generic specification: printed boards |
| BS 7822-3:1995 | Insulation coordination for equipment within low-voltage systems Use of coatings to achieve insulation coordination of printed board assemblies |
| BS EN 123700:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS 123800:2001 | System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections |
| BS 6221-12:1992 | Printed wiring boards Specification for mass lamination panels (semi-manufactured multilayer printed boards) |
| BS 5830:1979 | Specification for grid system for printed circuits |
| BS 6458-2.2(1984) : 1984 | FIRE HAZARD TESTING FOR ELECTROTECHNICAL PRODUCTS - METHODS OF TEST - NEEDLE FLAME TEST |
| BS 6413-0:1983 | Lubricants, industrial oils and related products (class L) Classification (general) |
| IEC 60454-3-1:1998+AMD1:2001 CSV | Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| BS 6458-2.1:1984 | Fire hazard testing for electrotechnical products. Test methods Glow-wire test |
| BS 6221-6:1982 | Printed wiring boards Specification for multilayer printed wiring boards |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| BS 6221-5:1982 | Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes |
| IEC 60326-1:1984 | Printed boards - Part 1: General information for the specification writer |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| BS 2011-2.1T:1981 | Environmental testing. Tests Test T. Soldering |
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